SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from BTU International


BTU Continues Advanced Research in Electronics Assembly

Jun 15, 2016

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL). The state-of-the-art APL currently houses a PYRAMAX™ 100N Reflow Oven with 400°C capability and will soon accept delivery of a PYRAMAX™ 125N Reflow Oven. The 125N features a 24" width process chamber enabling the processing of large boards for LED and other applications.

Our involvement in the APL has multiplied our capabilities in advanced SMT processes,” said Rob DiMatteo, Regional Sales Manager for BTU. “There are a number of process challenges and opportunities today in both SMT and packaging; we aim to be part of the solution,” added DiMatteo.

More than twenty years ago, Universal Instruments’ SMT Laboratory initiated a pre-competitive cooperative research effort with various Fortune 100 companies for the comprehensive development of the assembly processes for Ultra Fine Pitch and Tape Automated Bonded components. The project was organized to defray the high costs and associated technical risks among a large group of principals and to allow the researchers from the member companies an opportunity to cooperate in research projects. This highly successful research collaboration has evolved and adapted to the ever-changing demands of the electronic packaging and assembly industry. It developed into a series of funded research projects now known as the AREA Consortium.

The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set. For more information, visit www.uic.com/solutions/apl/area-consortium.


BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, New York, with offices in Europe, Asia, and the Americas.


 

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