Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
NC-SMQ75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of less than 0.5 percent (by weight) of solder paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with the reflow of high-melting die-attach alloys. It is particularly suitable for use with the industry standard die-attach solder alloys Indalloy 151 (Pb92.5/Sn5/Ag2.5) and Indalloy 163 (Pb95.5/Sn2/Ag2.5).
NC-SMQ75’s unique flux formulation allows manufacturers using non-wirebonded analog devices to eliminate the high cost of chemicals and waste generated by the cleaning step in power semiconductor assembly. NC-SMQ75, which has been in use for more than a year by multiple assemblers, including those in demanding high-reliability automotive applications, has been proven to meet JEDEC/IPC J-STD-020 and MSL1, 2, and 3 standards by manufacturers in Asia.
For more information about NC-SMQ®75, visit Indium Corporation’s booth N1-1661 at SEMICON China.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.