SMT, PCB Electronics Industry News

IPC APEX 2016 is 2 months away!

Jan 18, 2016

The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only two months away! Featuring world-class educational opportunities with leaders in industry practice and research, this year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward to helping you to meet your challenges and invite you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.

On Thursday, March 17th, 2016 from 9:00AM – 10:00 AM, Dr. Yin, a global leader in adhesives research and manufacturing will be presenting his white paper, “Can Lower Temperature Solderable Adhesive Replace SAC Paste?” He will not only discuss the development of low temperature solderable adhesives to replace SAC applications, but the myriad of benefits for use across industry domains. The low temperature solderable adhesives can be used anywhere, particularly for wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few. The reliability was equal or better than that of SAC alloy. The low temperature solderable adhesive has improved drop performance by two magnitudes compared to Sn/Bi alloy.

We at YINCAE Advanced Materials, LLC hope you will join us to learn about YINCAE and the exclusive products that you will not find with any other manufacturer in the world. We look forward to seeing you at booth 1718!

For more information, please visit our website: www.yincae.com

Oct 02, 2017 -

IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A

Sep 25, 2017 -

IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

Sep 12, 2017 -

SMTA International - Join Dr. Yin’s Presentation September 20th

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YINCAE to Exhibit at iMAPS INTERNATIONAL 2017

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SMTA International 2017 – 1 month away

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SMTA INTERNATIONAL is 1 MONTH AWAY! VISIT YINCAE BOOTH #329 September 19 & 20

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High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

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High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

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