Engineered Materials Systems (EMS), Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists.
The DF-3000 series is available in various thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists as well as conductive and non-conductive adhesives for semiconductor and circuit assembly applications.
Visit EMS/Nagase at ECTC to discuss Engineered Conductive Materials’ products and learn how the company can define, develop and create an engineered material solution that is right for your company. For more information, visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.