SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from KYZEN Corporation


KYZEN Offers Tips for Improving Device Reliability at the SMTA Intermountain Expo

Apr 07, 2015

David Lober

David Lober

KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.

The miniaturization of modern electronics continues to challenge the effectiveness of common cleaning processes and the ability to obtain desired cleaning performance and optimal yield. Highly dense assemblies have more interconnects per surface area, which results in tighter pitch and lower standoff gaps. As standoff gaps lower, flux residues have less area to outgas during reflow. This results in more active residues under bottom terminations.

Typically, a longer wash time is required to properly clean under the Z-axis. Exposed metallizations outside the solder alloy and pad finish now are common on highly dense assemblies. Reactive metals such as Al, Cu, Ag and Ni can react with cleaning agents. Potential metal incompatibilities has created the need for improved cleaning agents that clean while not materially attacking or corroding exposed metals.

Mr. Lober will discuss how companies that require devices to meet long-term reliability need an improved industry specification that allows for an accurate risk assessment. The problem is that the risk assessment is a multi-variable issue influenced by flux type, activation temperature, component type and placement as well as wash characteristics, solder paste volume, PCB cleanliness and component contamination. Generally “clean” does not mean product is clean where it matters most.

Lober joined KYZEN in 2010 as a process chemist, recruited for his Bachelor of Science in Chemistry at Rensselaer Polytechnic Institute in Troy, NY. He actively researches the effects of various cleaning agents to develop analytical testing methods that control precision cleaning processes. In KYZEN’s Analytical Lab, Lober oversees KYZEN’s Ion Chromatography program, both in operating the IC equipment and in analysis of results. Additionally, he collaborates with other KYZEN industry leaders to author publications and patents for KYZEN. Mr. Lober works primarily from KYZEN’s Nashville, TN office and may be reached by email at david_lober@kyzen.com or by phone at +1 615-831-0888.


KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.KYZEN.com.

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