Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
Die with thickness below 50 microns tend to be very compliant, in fact so much so that it becomes virtually impossible to apply a test load. Cantilever bend utilizes the shear action and precision controlled step back capability of the 4000Plus combined with special fixturing and software to bend the die at a fixed height (the loading height) from the datum plane. The method enables the calculation of flexural strength in Megapascals (Mpa) at the point of break.
The market drive for smaller, thinner mobile devices, memory cards and smart cards is creating challenges for both manufacturing and test. Cantilever bend is the result of a many months of work with a SEMI task force consortium Japan.For more information about Nordson DAGE, visit www.nordsondage.com.
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.
SEMI® is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, including:
•Flat Panel Display (FPD)
•Micro-electromechanical systems (MEMS)
•Printed and flexible electronics
•Related micro- and nano-electronics
The industries, companies, and people SEMI represents are the architects of the electronics revolution. SEMI members are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day.
For more than 40 years, SEMI has served its members and the industries it represents through programs, initiatives, and actions designed to advance business and market growth worldwide. SEMI supports its members through a global network of offices, activities, and events in every major electronics manufacturing region around the world