SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform

Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform

Dec 11, 2014

4000Plus platform

4000Plus platform

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.

Die with thickness below 50 microns tend to be very compliant, in fact so much so that it becomes virtually impossible to apply a test load. Cantilever bend utilizes the shear action and precision controlled step back capability of the 4000Plus combined with special fixturing and software to bend the die at a fixed height (the loading height) from the datum plane. The method enables the calculation of flexural strength in Megapascals (Mpa) at the point of break.

The market drive for smaller, thinner mobile devices, memory cards and smart cards is creating challenges for both manufacturing and test. Cantilever bend is the result of a many months of work with a SEMI task force consortium Japan.For more information about Nordson DAGE, visit www.nordsondage.com. 


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

SEMI® is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, including:

•Semiconductors
•Photovoltaics (PV)
•LED
•Flat Panel Display (FPD)
•Micro-electromechanical systems (MEMS)
•Printed and flexible electronics
•Related micro- and nano-electronics

The industries, companies, and people SEMI represents are the architects of the electronics revolution. SEMI members are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day.

For more than 40 years, SEMI has served its members and the industries it represents through programs, initiatives, and actions designed to advance business and market growth worldwide. SEMI supports its members through a global network of offices, activities, and events in every major electronics manufacturing region around the world

Oct 24, 2017 -

Nordson DAGE Announce 2017 European X-ray Distributor Award Winners

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 12, 2017 -

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Sep 12, 2017 -

Nordson Brings its Flagship Inspection Systems to SMTAI

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 15, 2017 -

Nordson Brings Its Flagship Inspection Systems to SMTAI

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Apr 26, 2017 -

Nordson DAGE Picks Up Its Third Award for the Quadra™ 7 X-ray

Feb 15, 2017 -

Nordson DAGE Receives the 2017 NPI Award for Test & Inspection – X-ray

Nov 07, 2016 -

Nordson DAGE Announces Cabiotec as European X-ray Distributor of the Year for X-ray Systems 2016

108 more news from Nordson DAGE »

Nov 17, 2017 -

Altus on the Road to Digital Factory of the Future

Nov 17, 2017 -

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Nov 17, 2017 -

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700

Nov 16, 2017 -

Europlacer Unveils its New Atom Platform.

Nov 16, 2017 -

Libra Industries installs another 3D post reflow AOI system at its Dallas facility

Nov 16, 2017 -

STI Participates in Manufacturing Day

Nov 16, 2017 -

ZESTRON to Exhibit at SMTA Silicon Valley

Nov 16, 2017 -

Comet Group Receives 2017 Global Technology Award for Test Services at Lab One

Nov 15, 2017 -

WKK Distribution Honored as Best Asian Distributor

Nov 15, 2017 -

KYZEN, the Leader in Cleaning Innovation, Receives Its 60th Industry Award

See electronics manufacturing industry news »

Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform news release has been viewed 681 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform
Plasma Prior to Conformal Coating

Reflow Oven