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  • Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Nov 18, 2014

4000Plus Bondtester

4000Plus Bondtester

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), reports that several leading manufacturers of complex multilayer printed circuit boards (PCBs) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.

Pad cratering can be caused by lead-free solders that transmit larger strains to the bond pad that, in turn, produce cracks in the laminate. These cracks can extend if the board is subject to high strain rates, shock or thermal cycling, which will result in the eventual failure of the interconnect.

Nordson DAGE use a special technique called “Hot Pin Pull” testing that involves attaching a test probe to an individual solder ball with a controlled temperate/time profile. Once cooled, the probe is subjected to a pull test that applies a test load that is symmetrical to the solder ball attach to the bonding pad. The entire process is localised to the solder ball/pad that is being tested. Variable angled work holders (typically 30°) are available as an option that maximise the tensile stress for those most highly strained bonds at the edge of the die.

The second-generation Nordson DAGE 4000Plus is the most advanced bondtester on the market. Representing the best-in-class, the 4000Plus sets the industry standard in bond testing by offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

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