CyberOptics® Corporation (NASDAQ: CYBE) will exhibit with its representative, Accelonix Iberica, in Booth 4D04 at Matelec 2014, scheduled to take place Oct. 28-31, 2014 at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain. CyberOptics’ flagship 3D SPI system – the SE600™ – and high-performance QX600™ AOI system will be demonstrated at the show.
The multi-award winning SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection. CyberPrint OPTIMIZER™, a unique value-add program, that automatically optimizes your printing process is part of the SE600™ software portfolio.
The QX600™ ultra-fast, ultra-versatile AOI system offers the fastest programming time with production-ready capability in less than 13 minutes. Built with an all-new Strobed Inspection Module (SIM), the QX600™ delivers the best 01005 and solder joint inspection ever. A high sensor resolution (12 µm) captures brilliant and crisp quality images for accurate defect review.For more information about CyberOptics, visit www.cyberoptics.com.
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. The Company’s products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. Through internal development and acquisitions, CyberOptics is strategically repositioning itself to become a global leader in high-precision 3D sensors.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we record in 2014; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI and other factors set forth in the Company’s filings with the Securities and Exchange Commission.