SMT, PCB Electronics Industry News

Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT

Oct 14, 2014

Ken Chiavone, Vice President of Engineering

Ken Chiavone, Vice President of Engineering

Akrometrix LLC, the leader in elevated temperature surface characterization, will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia. Ken Chiavone, Vice President of Engineering, will present “Analyzing Package-on-Package (PoP) Reflow Assembly Interfaces with Interconnect Gap Analysis.”

The product design and manufacturing processes related to package-on-package (PoP) devices continue to evolve, driven by the needs of mobile device OEMs and their end-user customers. Trends in the semiconductor industry are driving PoP assemblies to be thinner and smaller, while containing more interconnects than ever before. As the components that constitute a PoP device become thinner, with smaller-pitch solder joints, dynamic warpage during the reflow process has more potential to cause problems such as Head-in-Pillow and non-wet opens. This paper presents the latest technology for analyzing the compatibility of the assembled components to predict how well they will reliably solder, by evaluating how well their shapes match at each critical temperature throughout the reflow profile.

Chiavone leads the Product Development group at Akrometrix with an emphasis on integrating advanced technological capabilities with user experience, and generating results for product owners that deliver value to their organizations.  He is a graduate of Mercer University and for the last 20 years has designed innovative solutions in the industrial, medical, software and metrology industries.

Also at the show, company representatives will demonstrate the Interface Analysis software that allows allow high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
For more information, visit www.akrometrix.com.


Akrometrix LLC, the leader in elevated temperature surface characterization, was founded in 1993 by Dr. Charles Ume, a Professor and Director of the Advanced Electronic Packaging and Laser Processing Laboratory, at the George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia.  Headquartered in Atlanta, Akrometrix supports over 250 equipment installations worldwide.  For more information, contact Akrometrix at info@akrometrix.com.

Oct 16, 2017 -

Akrometrix Answers the Industry’s Demand for an Ultra-Fast Tabletop Warpage Metrology System Just in Time for productronica

Aug 30, 2017 -

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Aug 14, 2017 -

Akrometrix Launches New Tabletop Shadow Moiré (TTSM) at SMTA International

Jun 29, 2017 -

Akrometrix Launches New Warpage Metrology System – the Tabletop Shadow Moiré (TTSM)

Feb 15, 2017 -

Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX

Jan 10, 2017 -

Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX

Oct 04, 2016 -

Akrometrix Announces Next-Generation AXP Shadow Moiré System

Sep 23, 2016 -

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 22, 2016 -

Akrometrix Announces New Schedule for Technical Presentations

May 05, 2016 -

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

14 more news from Akrometrix »

Dec 12, 2017 -

ECT’s Switch Probes: Cost-Efficient Solutions for Testing Electronic Assemblies

Dec 12, 2017 -

NEO Tech Design Team Wins Industry Award for Creative Solutions that Accelerate Time-to-Market

Dec 12, 2017 -

STI Has Accomplished AS9100D Certification

Dec 07, 2017 -

Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 -

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 04, 2017 -

SCS to Discuss How Ultra-Thin Conformal Coatings Increase the Reliability of Critical Electronics during PennWell Webinar

See electronics manufacturing industry news »

Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT news release has been viewed 875 times

reflow oven profiler

Reflow Oven