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The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

Aug 25, 2014

Solder joint with WW50 after cleaning with de-ionized water

Solder joint with WW50 after cleaning with de-ionized water

The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Representatives from Balver Zinn and Cobar will display the company’s OT2 and WW50 solder paste along with the latest solder wire and flux technologies and services.

OT2 is Cobar’s latest halide and halogen free solder paste technology that is specially developed to meet continuously increasing customer requirements. The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.

Also at the show, the Balver Zinn Group will debut the new Cobar WW50 water soluble solder paste. The paste is compatible with the following alloys: Sn62, Sn63, SAC305 and SN100C, all with Type 3 powder. The rosinous halide-free nature of WW50 is unique, with paste rheology, solder-ability and water wash-ability conferred by carefully selected surface chemistry and activators. With the new WW50 branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the residues can be easily removed with de-ionized water.

Balver Zinn and Cobar offer solder bar, solder wire, solder flux, gel flux, cleaner and solder paste. For more information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com

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