SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jul 28, 2014

(Albany, NY)    July 28, 2014.  Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.


Increasing miniaturization in the electronic industry is a trend that can clearly be seen as time continues to move forward. The strength of solder joint or interconnects presents a challenging issue as it becomes more difficult to meet customers’ requirements. Underfilling the interconnects of rigid/flexible substrates does not solve the problem. SMT 266 - Solder joint encapsulant adhesive provides a reliable solution to the interconnect of rigid/flexible substrates. Using solder joint encapsulant adhesive not only doubles the strength of the interconnect compared to using traditional flux, but also ensures 100% manufacturing process yield. SMT 266 is used in line process, thus shortening the manufacturing process. The SMT 266 solder joint encapsulant adhesive provides a solution to all problems that miniaturization can cause.

If you would like to read the full white paper on “An Innovation Reliability Solution Interconnect of Flexible/Rigid Substrates” just click the following link. http://www.yincae.com/assets/white-paper-july2014-1.pdf


Additional information on the product series is available on our Website at http://www.yincae.com/products.html or by contacting YINCAE at info@yincae.com.


                                                         * * * * * * * *


YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

 
                                                                  ###


*The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 14, 2018 -

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 08, 2018 -

SEMICON WEST 2018 is in 2 Months!

Apr 09, 2018 -

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Mar 30, 2018 -

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Feb 08, 2018 -

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Jan 16, 2018 -

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

24 more news from YINCAE Advanced Materials, LLC. »

May 22, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

May 22, 2018 -

Koh Young Continues to Strengthen its Support Network for the Americas

May 21, 2018 -

Naprotek, Inc. Installs Flexible New MXI System

May 21, 2018 -

Ersa Holds National Sales Meeting with Hands on Training

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 21, 2018 -

KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

See electronics manufacturing industry news »

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates news release has been viewed 928 times

  • SMTnet
  • »
  • Industry News
  • »
  • An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates
SMT in-printer dispensing

x-ray inspection