SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China.

Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China.

Jul 28, 2014

3D AOI XM camera module for high-speed 3D inspection.

3D AOI XM camera module for high-speed 3D inspection.

Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China. 

Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.

Viscom’s all new FastFlow transport optimizes throughput and shortens cycle times.

3D AOI XM camera module - high-speed 3D inspection.

To meet current and future requirements in electronics manufacturing, not only must the inspection object as a whole be reliably detected, but each individual point of the object as well. This task is now solved in the XM module with the addition of a structured light projector to the existing orthogonal and angular cameras, totaling over 60 Megapixels. With an image acquisition rate of up to 1.8 gigapixels/second, the new XM module is extremely fast, and fully upgradeable for 3D.

Fastflow - new high-speed handling.

Due to synchronous input/output of electronic assemblies, Viscom’s all new high-speed transport facilitates trouble-free and extremely fast changeovers in as little as two seconds. Even extreme cycle time requirements can be fulfilled effortlessly.

Quality Uplink - efficient process control.

In SMT electronic assembly production, 3D SPI has established itself as the additional inspection point to complement optical or X-ray inspection. The key task is detecting unacceptable paste deposits in terms of volume, form, smearing and offset. In addition to providing defect detection, the Viscom 3D SPI can accomplish much more. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results.

Process Uplink offers three major advantages for production:

  1. An easier classification and prevention of human error and false calls by display of the AOI-SPI defect image pairs.
  2. Higher yield at the print process enabled by the additional display of SPI borderline defects at the AOI verification station.
  3. Direct process monitoring and improvement regarding paste print and solder defects.

Viscom AG manufactures and sells high-quality automatic optical and X-ray inspection systems. The company is one of the leading suppliers of 3-D solder paste inspection, component placement and solder joint inspection equipment in the PCB assembly market. Viscom systems ensure quality in surface mount technology production lines, where they can be interlinked to further improve productivity. The company’s headquarters and manufacturing operation is located in Hanover, Germany. With a wide network of branches, applications and service centers, Viscom is represented throughout Europe, Asia and the Americas. Founded in 1984, Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867) since 2006.

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

May 09, 2017 -

Viscom picks up two awards in Asia for its economical 3D AOI

May 08, 2017 -

Viscom Wins SMT China Vision Award for its Powerful 3D AOI Solution

Apr 03, 2017 -

Ultra-modern data exchange with the Viscom Open Interface 4.0

Mar 30, 2017 -

Optimal optical 3D solder joint measurement from Viscom

Mar 10, 2017 -

Save the date: Viscom Technology Forum starts June 21, 2017 in Hanover

Mar 08, 2017 -

Viscom Recognizes Matthews Associates for ‘Most 3D AOI System Sales’ in 2016

Feb 23, 2017 -

Networked 3D inspection from Viscom at DELTEC

Feb 23, 2017 -

Viscom Awards Horizon Sales for Outstanding Sales Performance

Feb 15, 2017 -

Viscom’s S3088 ultra gold wins the NPI Award for Test & Inspection – AOI

83 more news from Viscom AG »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China. news release has been viewed 1241 times

  • SMTnet
  • »
  • Industry News
  • »
  • Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China.

Software for SMT