May 05, 2014 
Engineered Material Systems, Inc. (EMS), a leading global supplier of negative photoresist materials for MEMs and IC cooling applications, introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-4017 film was developed to produce extremely hydrophobic (>90° contact angle) film surfaces. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-4017film is tougher (less brittle) than most negative photoresists in the market with a glass transition temperature of 145°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature, providing excellent chemical and moisture resistance.
DF-4017 film is compatible with and can be used in contact with the EMS line of spin coating photoresist. DF-4017 dry-film photoresist is the latest addition to EMS’ full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.
For more information about the new DF-4017 Dry Film Negative Photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronics and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.
