SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Plasmatreat Group


Productronica 2013: Plasmatreat presents latest plasma applications in electronics live!

Nov 02, 2013

© 2013 Plasmatreat.  
Openair®-Plasma allows microfine in-line cleaning and simultaneous activation of material surfaces without damaging the sensitive electronics

© 2013 Plasmatreat. Openair®-Plasma allows microfine in-line cleaning and simultaneous activation of material surfaces without damaging the sensitive electronics

Virtually potential-free, the market leader’s Openair® atmospheric plasma jet technology enables simultaneous microfine cleaning, activation and functional nano-coating of material surfaces without damaging the sensitive electronics in e.g. circuit boards or SMD assemblies. The innovative, green technology allows for brand-new in-line applications, which the company will be unveiling at the trade show.

A particular highlight of the event will be demonstration of the new desmearing process, which visitors will be able to experience live throughout the entire show.  This process enables atmospheric pressure plasma to be used for the first time to clean holes drilled in circuit boards or multiple layers for contacting purposes.  This important stage is currently performed using elaborate chemical or low-pressure plasma techniques which disrupt the manufacturing process. In contrast, desmearing using the inline Openair® process is done under normal atmospheric conditions, which saves space, simplifies and speeds up the process and substantially reduces costs.  “Especially in conjunction with the use of industrial gases, our technology is able to form a strongly abrasive plasma that delivers outstanding selectivity and high removal rates” explains Peter Langhof, Plasmatreat Electronics Marketing Manager.

Visitors will also have the opportunity to manually test the surface tension of their own components live before and after plasma treatment with a special surface analyser installed on the stand.  Langhof: “The dual effect of microfine cleaning and powerful activation in a single step far outweighs the effectiveness of conventional systems. Pretreatment with Openair® plasma significantly increases the adhesion capacity and wettability of the material surface in a precisely adjustable manner.  This ensures long-time stable bonding of adhesives and coatings even under the most challenging conditions.”

Further highlights include the latest FPC (fine powder coating) plasma process which creates functional coatings and effects on plastic surfaces in seconds and an on-screen illustration the reduction of lead frame copper surfaces by means of atmospheric plasma  to enhance adhesion during contacting.

About Plasmatreat
Plasmatreat is the international market leader in atmospheric pressure plasma jet technology. The company has technology centers in Germany (headquarters), the USA, Canada, China and Japan as well as subsidiaries and sales offices in more than 25 countries. Openair® plasma technology, first patented in 1995, is now used in virtually all sectors of industry around the world and is an integral step in the painting, coating and bonding process chain.

WELCOME AT OUR BOOTH at the
productronica 2013, 12 - 15 November, Munich, Germany.
Hall B2, Stand 117

For more information, please visit: www. plasmatreat.com

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