SMT, PCB Electronics Industry News

BTU International and Partners Present Assembly Process Workshop

Sep 17, 2013

 Fred Dimock

BTU International, Inc. today announced that it will present a workshop in conjunction with Koh Young Technology, Juki Corporation and Speedline Technologies. The free workshop will be hosted by ACI Technologies and will take place October 2-3, 2013, in Philadelphia, PA.

The workshop will address the importance of solder paste inspection (SPI) for reliability, advances in accuracy and speed in pick-and-place machines, including package on package (PoP), mastering proper soldering techniques with reflow ovens, and precision stencil printing.

Mastering solder paste reflow profiles is usually the last step to locking down the SMT assembly. Fred Dimock from BTU will discuss the development of reflow profiles for PCB solder reflow, semiconductor packaging, and lead-free processes.

Fred Dimock is the Manager of Process Technology at BTU International in Massachusetts. He holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.


BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe.

Information about BTU International is available at www.btu.com.

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