SMT, PCB Electronics Industry News

Inspecting In Three Dimensions

Sep 10, 2013

3-D MID inspection with the Viscom S6056, l. t. r.: Albert Birkicht, Managing Director, Guido Schatz, AOI Operator at HARTING AG, and Torsten Wichmann, Applications Specialist at Viscom AG.

3-D MID inspection with the Viscom S6056, l. t. r.: Albert Birkicht, Managing Director, Guido Schatz, AOI Operator at HARTING AG, and Torsten Wichmann, Applications Specialist at Viscom AG.

HARTING AG is increasingly using 3-D molded interconnect device (MID) technology for its customers in the automotive and medical technology sectors who demand very high quality. Until recently, HARTING has paid special attention to complex visual inspection during quality assurance. Now, Viscom’s S6056 MID inspection system is in use, enabling automatic inspection at maximum quality.

Certain defects, such as solder tombstones, cannot be avoided entirely, even in the best and most stable production process,” explains Albert Birkicht, Managing Director at HARTING AG in Biel. “A small percentage of defects always occur. The inspection must detect these defects reliably, especially for customers in the automotive and medical technology industries.”

When searching for a suitable inspection solution, it quickly became apparent that more than a typical inspection of a printed circuit board assembly was needed. The visual inspection of a three-dimensional circuit carrier is influenced primarily by the complex shape and contour of the product. Therefore, the inspection system must be able to inspect at various levels.

Furthermore, very different manufacturing processes are used during 3-D-MID production, e.g. assembling with solder paste, conductive adhesive or bonding. Additionally, the conducting paths typically are not uniform but can look completely different based on the manufacturing process. Depending on the type of faults expected and the necessary throughput, it must be possible to specifically adapt the resolution, inspection speed, lighting, color settings and camera angle.

The Viscom S6056 series, which is fully established and flexibly adaptable to varying requirements, forms the technical basis for 3-D AOI. The inspection system provides a z-axis, high inspection depth and speed, as well as verification and traceability solutions.

3-D inspection at HARTING takes place in two stages. First, the metallization of the lasered and galvanized copper, nickel or gold conducting paths and the terminal pad are inspected. Typical faults include foreign metallization, incomplete, detached, short-circuited or torn conducting paths, as well as geometric defects of the product or detectable faults and color variations on the two-component injection molding. After assembly and vapor phase soldering, the S6056 MID system inspects the MID assemblies and verifies that the right components are present, positioned and poled correctly on all the assemblies of the panel. Additionally, it detects inadequate solder joints, tombstone effects, short circuits and faults on the solder resist.

We are very impressed by the results of the Viscom 3-D inspection system,” says Birkicht. “The quality of the inspection and evaluations is high and the throughput has increased considerably. The automatic inspection is unerring: No defect is missed and processes can be controlled accurately, increasing the quality of the entire production process.”

HARTING currently uses the 3-D system for the inspection of a distance control system in high-volume production. “We will gradually inspect other 3-D-MID products with the Viscom system, especially the high-volume products that have particularly high-quality requirements,” Birkicht explains. “The capacity is expected to quickly reach its limits, which is why we are already thinking about a second S6056 MID system.”

May 09, 2017 -

Viscom picks up two awards in Asia for its economical 3D AOI

May 08, 2017 -

Viscom Wins SMT China Vision Award for its Powerful 3D AOI Solution

Apr 03, 2017 -

Ultra-modern data exchange with the Viscom Open Interface 4.0

Mar 30, 2017 -

Optimal optical 3D solder joint measurement from Viscom

Mar 10, 2017 -

Save the date: Viscom Technology Forum starts June 21, 2017 in Hanover

Mar 08, 2017 -

Viscom Recognizes Matthews Associates for ‘Most 3D AOI System Sales’ in 2016

Feb 23, 2017 -

Networked 3D inspection from Viscom at DELTEC

Feb 23, 2017 -

Viscom Awards Horizon Sales for Outstanding Sales Performance

Feb 15, 2017 -

Viscom’s S3088 ultra gold wins the NPI Award for Test & Inspection – AOI

Feb 07, 2017 -

Mobile Process Monitoring with the New Viscom App

82 more news from Viscom AG »

Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

See electronics manufacturing industry news »

Inspecting In Three Dimensions news release has been viewed 802 times

fluid dispensing pumps for integration

Used PCBA Equipment