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Koh Young Technology, a leading supplier of 3D SPI, AOI, and advanced automated inspection and measurement equipment for the electronics manufacturing industry worldwide, will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136
The new KY8030-3 Solder Paste Inspection (SPI) system featuring a new hardware platform that delivers greater robustness and reliability, and will also feature the newest KY software platform, more powerful and with greater functionality, with a true color display and foreign material inspection. Koh Young will also demonstrate much faster and easier real-time PCB warp compensation in the new KSMART Warp feature.
Koh Young will also exhibit its flagship Zenith 3D AOI system that measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, allowing a true comparison with the IPC-A-610 standard for inspection. Zenith identifies and flags all defects, allowing no escapes, thus serving as a powerful process optimization and quality assurance tool.
SMTA International 2013 takes place at the Fort Worth Convention Center, Fort Worth, Texas, October 13 - 17, 2013. For more information, visit http://www.smta.org/smtai/.
Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com
