The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference. The IWLPC will be held November 5-7, 2013 at the DoubleTree by Hilton Hotel in San Jose, California. Registration is now available on-line and Early Bird conference pricing is in effect until October 4, 2013, after which registration prices will go up $100.
On Tuesday, November 5, 2013, four application-oriented tutorials on Interposers, TSV’s, Wafer-Level Packaging, and Choosing Between Technologies will be instructed by experts in the field including Rao Tummala, Ph.D., from Georgia Institute of Technology, Luu Nguyen, Ph.D., from Texas Instruments, John H. Lau, Ph.D., from the Industrial Technology Research Institute (ITRI), and Herbert J. Neuhaus, Ph.D., TechLead Corporation.
The conference, on November 6 and 7, includes three tracks of technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. With a record number of abstracts received this year, the technical committee added two technical sessions on 2.5/3D Integration to help accommodate the many topics. A special session for Metrology and Test was created to focus on this under-served area of technology. A strong lineup of plenary speakers and panelists from the world of 3D and MEMS was assembled to provide success stories and offer a glimpse of new and emerging technologies and applications.
Paul Wesling, a CPMT Society Distinguished Lecturer, is scheduled to give an exciting and colorful history of device technology development and innovation in his presentation "The Origins of Silicon Valley: Why and How It Happened Here” during the Keynote Breakfast on November 6.
The exhibition expanded to include over 50 solutions providers showcasing everything from materials to equipment, from market research to metrology, from foundries to OSATs. Though mostly sold out, a few booths still remain in the exhibition.
Visit http://www.iwlpc.com for more information.
Contact Patti Hvidhyld at 952-920-7682 or firstname.lastname@example.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review, now entering its 16th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.