SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting

Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting

Jul 09, 2013

Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that its CEO Chetan Shah recently held a successful presentation for the Silicon Valley Chapter of the IPC Designer Council. The presentation, “Routing in the 3D World,” took place at JAVAD EMS in San Jose, CA.

Mr. Shah presented best practices for routing in the 3D world, including a discussion about designing reliable flexible circuits and the differences between rigid and flex circuits. Additional topics included materials selection – substrates, laminates and cover film, bend area considerations, the identification of stress points, using X-ray tools to locate fractures, and poor solder joints. The presentation was followed by a scheduled facility tour of FIT to give designers a deeper understanding of how flexible circuits are manufactured.

Future presentations are now being planned. For more information, contact FIT at engineer@fit4flex.com or visit www.fit4flex.com.


Flex Interconnect Technologies is the leader in flexible printed circuit technologies and can provide solutions to your interconnect problems. The company has advanced design, fabrication and assembly capabilities that can go from schematics to prototype in 10 days or less. FIT has expertise in producing a wide variety of Flex circuits, Rigid-flex circuits and HDI flex. Whether you are a first-timer or a veteran of the flexible printed circuit world, FIT can help you find a reliable and cost-effective solution. They provide complete Engineering Support, Design Layout, Quickturn Prototypes, Volume Production and Turnkey Assembly.

May 08, 2013 -

Flex Interconnect Technologies Appoints Veteran Applications Engineer

Mar 06, 2013 -

Flex Interconnect Technologies to Exhibit DATA LINK Cables with Samtec Connectors at the AeroDef Manufacturing Expo

Jan 21, 2013 -

Flex Interconnect Technologies Re-Certified as Lockheed Martin’s Approved Supplier for Flex and Rigid-Flex Circuits

Jan 10, 2013 -

Flex Interconnect Technologies to Highlight Its Standard DATA LINK Cables with Samtec Connectors at MD&M West

Nov 16, 2012 -

Flex Interconnect Technologies to Exhibit Custom Flex Technology Solutions at the BIOMEDevice Expo

Mar 14, 2012 -

Flex Interconnect Technologies Now Carries Samtec Flex Cable Lines

Jan 20, 2012 -

Flex Interconnect Technologies to Exhibit Custom Flex Technology Solutions at MD&M West 2012

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting news release has been viewed 1225 times

  • SMTnet
  • »
  • Industry News
  • »
  • Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting
Reflow Oven

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit