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Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting

Jul 09, 2013

Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that its CEO Chetan Shah recently held a successful presentation for the Silicon Valley Chapter of the IPC Designer Council. The presentation, “Routing in the 3D World,” took place at JAVAD EMS in San Jose, CA.

Mr. Shah presented best practices for routing in the 3D world, including a discussion about designing reliable flexible circuits and the differences between rigid and flex circuits. Additional topics included materials selection – substrates, laminates and cover film, bend area considerations, the identification of stress points, using X-ray tools to locate fractures, and poor solder joints. The presentation was followed by a scheduled facility tour of FIT to give designers a deeper understanding of how flexible circuits are manufactured.

Future presentations are now being planned. For more information, contact FIT at engineer@fit4flex.com or visit www.fit4flex.com.


Flex Interconnect Technologies is the leader in flexible printed circuit technologies and can provide solutions to your interconnect problems. The company has advanced design, fabrication and assembly capabilities that can go from schematics to prototype in 10 days or less. FIT has expertise in producing a wide variety of Flex circuits, Rigid-flex circuits and HDI flex. Whether you are a first-timer or a veteran of the flexible printed circuit world, FIT can help you find a reliable and cost-effective solution. They provide complete Engineering Support, Design Layout, Quickturn Prototypes, Volume Production and Turnkey Assembly.

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