SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Call for Participation in the 13th Electronic Circuits World Convention

Call for Participation in the 13th Electronic Circuits World Convention

Jul 09, 2013

 IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 13th Electronic Circuits World Convention (ECWC13) taking place May 7–9, 2014, at the Nuremberg Convention Center, Germany. Sponsored by the World Electronic Circuits Council (WECC), organized by European Institute of Printed Circuits (EIPC) and hosted by Mesago Messe Frankfurt GmbH, ECWC13 will focus on the challenges that product miniaturization, energy savings and printed electronics present to the electronics manufacturing industry.

Expert presentations are being sought on topics pertaining to management as well as technology. Management topics of interest include: electronics global market trends; supply chain management; environment, health and safety; business models and strategy; certification and qualifications; and total cost of ownership and overall equipment efficiency. Technology topics of interest include: design and development tools; materials, components and traceability; manufacturing; quality, test and life cycle management; PCB processes; surface mounting, assembly and interconnection; packaging technology; energy and resource efficiency; application-specific areas; and advanced and emerging technologies.

Abstracts should be three or fewer pages, noncommercial, summarize original and previously unpublished research and discoveries, and discuss significant test results and trends of interest. Outstanding papers will be honored with awards at the conference’s closing ceremony.

The deadline for abstract submission is September 13, 2013. To submit an abstract or proposal, visit www.ecwc13.org.

For more information about conference presentations, contact the event host Mesago Messe Frankfurt GmbH at smt@mesago.com or David Bergman, IPC vice president of international relations, at DavidBergman@ipc.org or +1 847-597-2840. 



 

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 18, 2017 -

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Sep 18, 2017 -

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

Sep 12, 2017 -

IPC Joins Industry Coalition in Support of U.S. EPA in Litigation over Chemical Safety Act

Sep 11, 2017 -

IPC APEX EXPO 2018 Opening Keynote from Jared Cohen Will Highlight Technology’s Game Changers

Sep 07, 2017 -

Wage and Salary Survey Deadline for North American Electronics Assembly Industry Extended to September 29

Sep 07, 2017 -

IPC Praises Federal Court Decision to End Overtime Rule

Sep 06, 2017 -

Grupo Mirgor First Company in South America to Earn Certification as Qualified Manufacturer to IPC-J-STD-001/610 Recognized as IPC-Trusted Source and QML-Listed

Sep 03, 2017 -

North American PCB Orders Up, Sales Down, Raising Book-to-Bill Ratio

850 more news from Association Connecting Electronics Industries (IPC) »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

See electronics manufacturing industry news »

Call for Participation in the 13th Electronic Circuits World Convention news release has been viewed 527 times

  • SMTnet
  • »
  • Industry News
  • »
  • Call for Participation in the 13th Electronic Circuits World Convention
reflow oven profiler

Nitrogen Capable SMD & BGA Rework Station