Jul 09, 2013 IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 13th Electronic Circuits World Convention (ECWC13) taking place May 7–9, 2014, at the Nuremberg Convention Center, Germany. Sponsored by the World Electronic Circuits Council (WECC), organized by European Institute of Printed Circuits (EIPC) and hosted by Mesago Messe Frankfurt GmbH, ECWC13 will focus on the challenges that product miniaturization, energy savings and printed electronics present to the electronics manufacturing industry.
Expert presentations are being sought on topics pertaining to management as well as technology. Management topics of interest include: electronics global market trends; supply chain management; environment, health and safety; business models and strategy; certification and qualifications; and total cost of ownership and overall equipment efficiency. Technology topics of interest include: design and development tools; materials, components and traceability; manufacturing; quality, test and life cycle management; PCB processes; surface mounting, assembly and interconnection; packaging technology; energy and resource efficiency; application-specific areas; and advanced and emerging technologies.
Abstracts should be three or fewer pages, noncommercial, summarize original and previously unpublished research and discoveries, and discuss significant test results and trends of interest. Outstanding papers will be honored with awards at the conference’s closing ceremony.
The deadline for abstract submission is September 13, 2013. To submit an abstract or proposal, visit www.ecwc13.org.
For more information about conference presentations, contact the event host Mesago Messe Frankfurt GmbH at smt@mesago.com or David Bergman, IPC vice president of international relations, at DavidBergman@ipc.org or +1 847-597-2840.
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