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Flex Interconnect Technologies Re-Certified as Lockheed Martin’s Approved Supplier for Flex and Rigid-Flex Circuits

Jan 21, 2013

Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that it has been re-certified by Lockheed Martin Missiles and Fire Control as its approved supplier for producing flex and rigid-flex circuits to IPC-6011 class 3 and IPC-6013 class 3. FIT manufactured flex boards had the rating of 100 percent on time delivery and 100 percent quality.

The certification allows FIT to continue to produce parts for all of the Lockheed Martin divisions as well as the company’s Tier 1 suppliers. To accomplish this, FIT demonstrated that its quality system conforms to both AS9100C standards and the company completely implemented IPC-6011 class 3 and IPC-6013 class 3 specifications as part of its day-to-day operations in manufacturing flexible circuits.

Lockheed Martin has been wonderful to us. They are a great partner and have played a key role in driving us to maintain the highest level of quality in our parts and our service. We are honored to have the continued opportunity to work with them,” said Dean T. Matsuo, CTO of Flex Interconnect.

In addition to ISO 9001:2008, AS9100 Rev C and UL certifications, FIT is ITAR certified. All manufacturing for FIT is completed right here in the United States and the company continues to contribute to rebuilding the American economy.

For more information about Flex Interconnect Technologies, visit www.fit4flex.com.


Flex Interconnect Technologies is the leader in flexible printed circuit technologies and can provide solutions to your interconnect problems. They have expertise in producing a wide variety of Flex circuits, Rigid-flex circuits and HDI flex. Whether you are a first-timer or a veteran of the flexible printed circuit world, FIT can help you find a reliable and cost-effective solution. They provide complete Engineering Support, Design Layout, Quickturn Prototypes, Volume Production and Turnkey Assembly.

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