SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • AIM’s Karl Seelig to Discuss Lead-Free Alloy Development during SMTA International

AIM’s Karl Seelig to Discuss Lead-Free Alloy Development during SMTA International

Sep 17, 2012

 Karl Seelig, Vice President of Technology,

 AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that Karl Seelig, Vice President of Technology, will present a paper titled “Lead-Free Alloy Development” at the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL. The presentation will be held during Session MFX1 titled “Alternate Solder Alloys for Various Applications,” which will take place Tuesday, October 16, 2012 from 10:30 a.m. – 12:30 p.m. in room Asia 4.

The purpose of this paper is to investigate several factors relating to the families of alloys; both low silver and non-silver.  These factors include the use of these alloys as possible replacement alloys in solder paste for component attachment and the comparison of the paste medium chemistries of these alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock.  Other important characteristics that will be addressed include wetting, voiding, and head-in-pillow mitigation.

In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.

For more information about AIM, visit www.aimsolder.com.


Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail info@aimsolder.com.
 

Jan 29, 2014 -

AIM Solder Expands Technical Support in Mexico

Jan 10, 2014 -

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Nov 08, 2013 -

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Jul 10, 2013 -

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

May 13, 2013 -

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 07, 2013 -

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Apr 30, 2013 -

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 25, 2013 -

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 19, 2013 -

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 08, 2013 -

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

36 more news from AIM Solder »

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

Aug 16, 2017 -

COT Increases Manufacturing Capability with New DMG Horizontal Milling Centers

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

Aug 16, 2017 -

Innovative Bench-top Soldering Equipment from Metcal at SMTAI

Aug 16, 2017 -

ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots

See electronics manufacturing industry news »

AIM’s Karl Seelig to Discuss Lead-Free Alloy Development during SMTA International news release has been viewed 633 times

  • SMTnet
  • »
  • Industry News
  • »
  • AIM’s Karl Seelig to Discuss Lead-Free Alloy Development during SMTA International
PCB machines

Large PCB Dispensing System