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AIM’s Karl Seelig to Discuss Lead-Free Alloy Development during SMTA International

Sep 17, 2012

 Karl Seelig, Vice President of Technology,

 AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that Karl Seelig, Vice President of Technology, will present a paper titled “Lead-Free Alloy Development” at the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL. The presentation will be held during Session MFX1 titled “Alternate Solder Alloys for Various Applications,” which will take place Tuesday, October 16, 2012 from 10:30 a.m. – 12:30 p.m. in room Asia 4.

The purpose of this paper is to investigate several factors relating to the families of alloys; both low silver and non-silver.  These factors include the use of these alloys as possible replacement alloys in solder paste for component attachment and the comparison of the paste medium chemistries of these alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock.  Other important characteristics that will be addressed include wetting, voiding, and head-in-pillow mitigation.

In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.

For more information about AIM, visit www.aimsolder.com.


Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail info@aimsolder.com.
 

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