SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Hesse Mechatronics


Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Aug 02, 2012

 Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta. 

Prospect Technical Sales represents manufacturers of advanced-technology microelectronic assembly and test products in the northwest USA and Canada. Steve Buerki, Prospect Technical Sales Principal/Account Manager, brings more than 25 years experience in the microelectronics market working in both technical sales and manufacturing.

Specializing in microelectronic assembly services as well as bonding equipment, Prospect Technical Sales can quickly and accurately access application requirements to recommend an ideal course of action for our semiconductor customers,” notes Buerki, who personally has a strong background in electronics, optoelectronics and vacuum sciences. “Because we are uniquely qualified to support a customer before and after the sale, we establish and maintain cooperative, long-term customer supplier relationships.”

Prospect Technical Sales will be a valuable resource in establishing long-term customer relationships in new territories throughout Canada and the northwest United States,” notes Joseph S. Bubel, President of Hesse & Knipps, Inc. “Their combined technical and sales background in bonders supports our strategy of providing stronger customer support to existing customers and establishing new partnerships with additional semiconductor manufacturers along the West Coast and Canada.”

For more information on Hesse & Knipps wedge bonders, please visit the company’s website at www.hesse-knipps.com; to view videos of wedge bonding equipment in action, please visit www.wirebonddemo.com. For more information about the Prospect Technical Sales, please contact Steve Buerki at sbuerki@pacbell.net. 


Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. 

For more information, please visit the company’s website at www.hesse-knipps.com.
 

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