How can you prepare new product introductions more effectively, create error-free placement programs and make sure that even the first batch of a product is produced with maximum quality? The latest issue of the popular SIPLACE SMT-Insights whitepaper series focuses on the complex processes involved in new product introductions (NPIs). On only 20 pages, the new publication presents solutions for everyday challenges, lots of tips and tricks, and a convenient checklist for the NPI process. It is directed towards manufacturers who want to implement robust NPI processes in their high-mix electronics production environments with consistent tool chains in order to raise the efficiency and quality of their new product introductions, which occur with increasing frequency. Electronics manufacturers can order this and other whitepaper from the SIPLACE SMT-Insights series at no charge or download them from the Internet. For more information, visit www.siplace.com.
With its SIPLACE SMT-Insights: NPI whitepaper, the SIPLACE team provides electronics manufacturers with a compact reference to making NPI processes more efficient. The SIPLACE experts put to use their many years of experience in the field to provide practical advice on the multitude of challenges along the process chain consisting of program creation, verification, preparation and production. Readers will learn how even the first yield can be produced efficiently and error-free despite faulty Gerber data, incomplete bills of material, missing or late component descriptions, or if only a small quantity of components is initially available.
Incomplete NPI tool chain and lack of placement solution flexibility
According to the experts, gaps in the tool chains and lack of flexibility in the available placement solutions are the main causes of shortcomings in the NPI process. For example, many electronics manufacturers are unable to efficiently check and correct the product data supplied by the customer, or to verify placement programs offline. Correcting product data after the first batch has been run or using active lines as trial beds creates high NPI costs, however. In addition, the placement solutions of many producers are unable to efficiently insert prototypes or small-batch jobs into the production schedule, setting them up with the required flexibility, or teach new components on the line. The new brochure highlights solutions for all these issues that help users to systematically eliminate weak spots in the NPI process.
“In modern electronics plants, new product introductions are rapidly developing from something unusual to a standard process. While spending money to optimize an occasional specialty process did not make sense in the past, today’s frequent new product introductions provide plenty of potential for efficiency improvements and cost reductions. Just like they did on subjects such as 01005, vision systems or maintenance, our SIPLACE specialists have put together a useful compendium on the subject of NPI that can be downloaded online or ordered at no charge,” explains Thomas Hüttl, Produkt Marketing Manager on the SIPLACE team.
To get additional information about the SIPLACE SMT-Insights series of whitepapers, visit www.siplace.com.
With its SIPLACE SMT-Insights: NPI whitepaper, the SIPLACE team provides electronics manufacturers with a compact reference to making NPI processes more efficient.
For more Information, visit www.siplace.com.
At the beginning of 2011, the SIPLACE team (formerly Siemens Electronics Assembly Systems) became a business unit of ASM Pacific Technology and operates now as ASM Assembly Systems. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology (SMT) placement machines and solutions. Since its beginnings in 1985, the company has installed almost 35,000 placement machines at over 3,500 customers all over the world. Electronics manufacturers in all industries such as telecommunications, automotive, IT, consumer electronics and automation use and depend on SIPLACE’s broad portfolio of solutions and services.
For more information about ASM Assembly Systems (SIPLACE), visit www.siplace.com.
As a subsidiary of ASM International, which has its headquarters in Almere, Netherlands, ASM Pacific Technology (ASMPT), Singapore, has developed in only a few years into the world’s leading supplier of chip assembly, bonding and packaging systems and solutions. The ASMPT Group produces and markets machines for front-end and back-end chip assembly and semiconductor packaging. The company has plants in Hong Kong, China, Singapore and Malaysia, and since January 1, 2011 in Germany. ASMPT has been listed on the Hong Kong Stock Exchange since 1989.
ASMPT is one of the stocks in the Hang Seng HK MidCap Index under the Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, and the Hang Seng Hong Kong 35 Index.
For more information about ASMPT, visit www.asmpacific.com
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