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  • Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Jun 01, 2012

PBGA 928-HiP

PBGA 928-HiP

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect. 

The HiP effect takes place when the solder joint and the sphere are touching but no intermetallic layer is formed. Lead-free assemblies have increased warpage due to their higher processing temperatures. Mastering the correct soldering profile and paste is essential. 

PBGA 928-HiP is maximized to create the HiP effect due to component warpage with its large plastic body size combined with the small single die. This combination creates the maximum thermal expansion mismatch. 

These components have a 1.0 mm pitch with perimeter ball alignment and the tray quantity is 21. Minimum order quantities may apply. 


Since 1996, Practical Components has been the world’s leading supplier of dummy components, which are the exact mechanical equivalents of live components, used when only the physical properties of the components are required. These components can cost as much as 80% less than live components, making them ideal for testing of solder processes, machine setup and other process evaluations. Practical Components is headquartered in Los Alamitos CA and has a worldwide distribution network. For more information, visit www.practicalcomponents.com.

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