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  • IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

May 30, 2012

 Over two days in August, the technical conference at IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics. IPC Midwest Conference & Exhibition will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center Hotel, in Schaumburg, Ill.

"This conference is all about giving engineers processing tools and information to work smarter in an age of increasing sophistication of assembly packaging and soldering materials,” says John Perry, IPC technical conference manager. “We’ve selected subject-matter experts from around the globe that will provide companies with solutions and insights to help them boost productivity and reliability.”

On Wednesday, August 22, the morning session, “Reliability Challenges of Bottom Termination Components,” will cover how to effectively manage the complexities of BTCs — the reduction of conductor pitch, spacing and stand-off height. Papers will address cleaning challenges in an HDI world, the mitigation or elimination of pad cratering, and printing and assembly challenges of quad flat no-lead (QFN) devices.

The afternoon will host two sessions: one on advances in assembly coatings and alternatives and the second on advances in reliability testing. “Assembly Coatings and Alternatives” will reveal new coating materials that incorporate nanoparticle technology, address low-temperature curing processes utilizing transient phase liquid sintering technology, and provide valuable insights into converting to low VOC conformal coating materials.

In “Advances in Reliability Testing,” industry experts will discuss minimizing soldering defects. Papers on capillary ion chromatography, moisture diffusion in electronic packaging materials, and mitigation strategies for ensuring reliable ENIG solderability will help companies minimize product recalls.

On Thursday, August 23, the day will begin with a look at innovative assembly processes for improving yields, service life and reliability in “Application Processing for Solder Related Materials.” Later that morning, the focus will turn to “Assembly Process Soldering Materials,” which will provide valuable information to engineers looking to characterize lead-free solder alloys and maintain reliability in their soldering processes.

Complete information on the technical conference paper sessions at IPC Midwest is available at www.IPCMidwestShow.org/conference. Special savings of 20 percent off the technical conference or other fee-based show events is available through July 20, 2012.

To register or for more information on all the activities taking place at IPC Midwest Conference & Exhibition, including standards development meetings as well as free events, such as the opening session on nanotechnology and electronics assembly and the exhibition, visit www.IPCMidwestShow.org.

This year, IPC Midwest will also host the IPC Executive Summit on August 21–22. For more information, visit www.IPCMidwestShow.org/executive-summit.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

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