SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

May 30, 2012

 Over two days in August, the technical conference at IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics. IPC Midwest Conference & Exhibition will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center Hotel, in Schaumburg, Ill.

"This conference is all about giving engineers processing tools and information to work smarter in an age of increasing sophistication of assembly packaging and soldering materials,” says John Perry, IPC technical conference manager. “We’ve selected subject-matter experts from around the globe that will provide companies with solutions and insights to help them boost productivity and reliability.”

On Wednesday, August 22, the morning session, “Reliability Challenges of Bottom Termination Components,” will cover how to effectively manage the complexities of BTCs — the reduction of conductor pitch, spacing and stand-off height. Papers will address cleaning challenges in an HDI world, the mitigation or elimination of pad cratering, and printing and assembly challenges of quad flat no-lead (QFN) devices.

The afternoon will host two sessions: one on advances in assembly coatings and alternatives and the second on advances in reliability testing. “Assembly Coatings and Alternatives” will reveal new coating materials that incorporate nanoparticle technology, address low-temperature curing processes utilizing transient phase liquid sintering technology, and provide valuable insights into converting to low VOC conformal coating materials.

In “Advances in Reliability Testing,” industry experts will discuss minimizing soldering defects. Papers on capillary ion chromatography, moisture diffusion in electronic packaging materials, and mitigation strategies for ensuring reliable ENIG solderability will help companies minimize product recalls.

On Thursday, August 23, the day will begin with a look at innovative assembly processes for improving yields, service life and reliability in “Application Processing for Solder Related Materials.” Later that morning, the focus will turn to “Assembly Process Soldering Materials,” which will provide valuable information to engineers looking to characterize lead-free solder alloys and maintain reliability in their soldering processes.

Complete information on the technical conference paper sessions at IPC Midwest is available at www.IPCMidwestShow.org/conference. Special savings of 20 percent off the technical conference or other fee-based show events is available through July 20, 2012.

To register or for more information on all the activities taking place at IPC Midwest Conference & Exhibition, including standards development meetings as well as free events, such as the opening session on nanotechnology and electronics assembly and the exhibition, visit www.IPCMidwestShow.org.

This year, IPC Midwest will also host the IPC Executive Summit on August 21–22. For more information, visit www.IPCMidwestShow.org/executive-summit.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Feb 22, 2018 -

IPC Issues Position Paper on Priorities for an Ambitious EU Industrial Policy Strategy Supports skills gap closure, R&D incentives and strong IP protection

Feb 19, 2018 -

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Feb 14, 2018 -

Show Floor Sells Out for IPC APEX EXPO 2018

Feb 12, 2018 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Dieg

Feb 08, 2018 -

IPC STEM Outreach Program Introduces Students to the Electronics Industry at IPC APEX EXPO 2018

Feb 05, 2018 -

Industry 4.0 Gets Significant Boost at IPC APEX EXPO 2018 More than 20 companies to participate in IPC CFX Showcase

Jan 31, 2018 -

IPC Welcomes New Senior Director of Education Programs

Jan 28, 2018 -

IPC’s Enterprise Membership Option Simplifies Dues Structure

Jan 22, 2018 -

Salary Budgets are Rising, Says New IPC Salary Study

Jan 11, 2018 -

IPC North American EMS and PCB Statistical Programs Open

882 more news from Association Connecting Electronics Industries (IPC) »

Feb 22, 2018 -

KIC demonstrates smart factory technologies with IPC CFX communication at APEX

Feb 22, 2018 -

MicroCare Offers Higher Performance Critical Cleaning Solutions at IPC APEX Booth #2909

Feb 22, 2018 -

Latest Conference Proceedings Now Available in SMTA Knowledge Base

Feb 22, 2018 -

Scienscope to Exhibit Flexible X-ray Component Reel Counter at productronica China

Feb 22, 2018 -

IPC Issues Position Paper on Priorities for an Ambitious EU Industrial Policy Strategy Supports skills gap closure, R&D incentives and strong IP protection

Feb 22, 2018 -

Data Logging: Intelligently and Efficiently

Feb 22, 2018 -

KDPOF Enables Seamless Optical Networks Integration

Feb 22, 2018 -

XJTAG Announces DFT Assistant for Zuken CR-8000 PCB design suite

Feb 21, 2018 -

Joseph Stockunas, Nordson Corporation Corporate VP, Appointed to SEMI Foundation Board of Trustees

Feb 21, 2018 -

VJ Electronix Hires Industry Expert to Continue Strengthening Global Sales and Services

See electronics manufacturing industry news »

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS news release has been viewed 1000 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS
Small Parts Tips

x-ray inspection