SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ZESTRON Corporation

IPC/APEX 2012 Recap: ZESTRON Introduces HYDRON® WS 325

Mar 09, 2012

During the recent IPC/APEX 2012, Sal Sparacino, Technical Marketing Manager, ZESTRON, met with Global SMT & Packaging Editor Trevor Galbraith to discuss the cleaning concerns with DI-water processes for high reliability applications and what ZESTRON is doing to offer solutions.

PCB manufacturers know that standoff heights are decreasing, components are being miniaturized and boards are becoming more densely populated and thus cleanliness, and therefore ultimately reliability, are becoming more prevalent issues in the electronics manufacturing industry,” says Sal Sparacino. “Especially when cleaning OA fluxes, field experience has shown that DI-water only processes are no longer providing the required cleanliness results.

To respond to market demands, ZESTRON has developed HYDRON® WS 325. HYDRON® WS 325 is a revolutionary FAST® Technology based cleaning agent specifically designed for water-soluble (OA) defluxing spray-in-air inline and batch cleaning applications.  Applied at low concentrations (3% to 5%), the cleaning agent has been developed to penetrate the capillary spaces underneath low standoff components where DI-water only applications can no longer provide reliable cleanliness levels.  HYDRON® WS 325’s mild formulation is particularly gentle on all sensitive materials and solder joints.

For more information about this latest innovation and ZESTRON’s complete line of products and services, please visit

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information or to tour one of our unparalleled technical centers, please visit

You must be a registered user to talk back to us.

More News from ZESTRON Corporation

Aug 26, 2015 -

Ravi Parthasarathy, ZESTRON, to Present at the SMTA Capital Expo and Tech Forum

Aug 16, 2015 -

Axel Vargas, ZESTRON, to Present “Improvements in Yield and Reliability for SMT Processes via Cleaning” in Manaus-AM, Brazil

Aug 06, 2015 -

Advanced Webinar “Cleaning Process Efficiency: Static and Dynamic Cleaning Rates” Presented by ZESTRON Academy

Jul 21, 2015 -

ZESTRON Academy to Host Collaborative Workshop “Solder Metallurgy, Stencil Design and Process Optimization” in Brazil

Jul 14, 2015 -

ZESTRON to Showcase Latest pH Neutral Products at SMTA Ohio Expo and Tech Forum

Jul 09, 2015 -

ZESTRON Introduces New Enhanced Maintenance Cleaner, VIGON® RC 303

Jul 01, 2015 -

Free Webinar “DI-water and Low Standoff Cleaning Challenges” Presented by ZESTRON Academy

Jun 23, 2015 -

ZESTRON to Showcase Latest pH Neutral Products, VIGON® PE 180 and HYDRON® SE 220, at SMTA Upper Midwest Expo

Jun 09, 2015 -

Kalyan Nukala, ZESTRON, to Present “Improvements in Yield and Reliability for SMT Processes” at Assembly, Cleaning, Coating, and Reliability Workshop in Schaumburg, IL

Jun 08, 2015 -

ZESTRON to Host the SMTA Capital Chapter Tutorial Program on June 9th, 2015

(223) more news from ZESTRON Corporation

IPC/APEX 2012 Recap: ZESTRON Introduces HYDRON® WS 325 news release has been viewed 352 times

Surface Analytics - PCB Cleaning Webinar - Zestron

Soldering Kits