Mar 09, 2012 During the recent IPC/APEX 2012, Sal Sparacino, Technical Marketing Manager, ZESTRON, met with Global SMT & Packaging Editor Trevor Galbraith to discuss the cleaning concerns with DI-water processes for high reliability applications and what ZESTRON is doing to offer solutions.
“PCB manufacturers know that standoff heights are decreasing, components are being miniaturized and boards are becoming more densely populated and thus cleanliness, and therefore ultimately reliability, are becoming more prevalent issues in the electronics manufacturing industry,” says Sal Sparacino. “Especially when cleaning OA fluxes, field experience has shown that DI-water only processes are no longer providing the required cleanliness results.”
To respond to market demands, ZESTRON has developed HYDRON® WS 325. HYDRON® WS 325 is a revolutionary FAST® Technology based cleaning agent specifically designed for water-soluble (OA) defluxing spray-in-air inline and batch cleaning applications. Applied at low concentrations (3% to 5%), the cleaning agent has been developed to penetrate the capillary spaces underneath low standoff components where DI-water only applications can no longer provide reliable cleanliness levels. HYDRON® WS 325’s mild formulation is particularly gentle on all sensitive materials and solder joints.
For more information about this latest innovation and ZESTRON’s complete line of products and services, please visit www.zestron.com.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information or to tour one of our unparalleled technical centers, please visit http://www.zestron.com.
