Seika Machinery Receives a 2012 NPI Award for Its Low-VOC Stencil Cleaner

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it has been awarded a 2012 NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner. The award was presented to Daido Sawairi from Sawa Corporation and Seika Machinery’s Michelle Ogihara during a Tuesday, February 28, 2012 ceremony that took place at the San Diego Convention Center in California.

The Ecobrid stencil cleaner provides a 66 percent reduction in CO2 emissions and energy consumption over the previously fully automatic cleaning system offered as well as a huge reduction in running costs. Additionally, the system cleans and dries in just ten minutes or less.

The fully automatic cleaner features easy-to-use touch panel operation. The system uses a low-VOC solvent, making it environmentally-friendly and resulting in little to no flash point concerns. As an additional benefit, the slide-in mechanism allows for ease of stencil insertion for cleaning. 

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information about Seika’s Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner, contact Seika at 310-540-7310 or stop by Booth #2401 at the IPC APEX Expo from April 28-March 1, 2012.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.