Feb 17, 2012 
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it will co-sponsor and participate in a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT. Keith Bryant, Nordson DAGE’s Global Sales Director and SMART Group’s Chairman, will present industry-leading information about PoP inspection during the Webinar.
“Nordson DAGE X-ray Systems is proud to be involved in this cutting-edge technology webinar that will take place during the NEW UK 2012 exhibition,” said Bryant.
His presentation will discuss how PoP and other stacked device formats have rapidly risen in popularity in markets where space is at a premium, for example, handheld devices where customers and the market continually demand increased features and capacity in the same or smaller footprint. The new packages that meet these requirements soon become the “industry standard” due to the volumes purchased. In turn this leads to the obsolescence of the older, larger packages and the need to cope with the production, inspection and test challenges of these “new” package types. The industry has moved very quickly from using simple BGAs to mounting flip chips directly onto PCBs and so it is equally important that these new device types do not remain a mystery to those who have to place and inspect them. Bryant’s presentation is designed to take the mystery out of PoP and give attendees the tools to cope with this technology.
Nordson DAGE’s presentation also will explain how their new X-Plane™ technology benefits PoP users.
X-Plane™ is a revolutionary option for its range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ technology is quick, simple and easy-to-use. The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.
The Webinar is free to the public and will be co-presented by Bob Willis and members of the POP Centre Team. Visit https://www1.gotomeeting.com/register/500801256 to reserve your seat. Act quickly because space is limited to 100 attendees.
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.
Nordson Corporation delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson at www.nordson.com, twitter.com/Nordson_Corp, or Facebook.com/Nordson.
