SMTA SE Asia Technical Conference Program Finalized

Feb 16, 2012

SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 18-20, 2012 at the Eastin Hotel in Penang, Malaysia.

Conference Chair Dr. LyGuat Lee, Flextronics, has assembled a highly technical program that will be very informative for attendees of various backgrounds. Conference sessions will cover Soldering Processes and Materials, Soldering Challenges - Including Head in Pillow, Business and Supply Chain, Harsh Environments, Soldering - Through Hole Processes, Substrates and Printed Circuit Boards, Components and Advanced Packaging.

Companies participating in the program include Agilent Technologies, Celestica, Inc., Cisco Systems Ltd., Henkel, IBM Corporation, Indium Corporation, Kester, and Plexus Corp.

Training workshops will be held on Wednesday, April 18. Workshop topics will be Reliability of Lead-Free Solder Joints, Designing for Reliability, and Electromigration.

Event website: http://smta.org/education/symposia/symposia.cfm#penang

The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.

Contact Patti Hvidhyld, patti@smta.org, with questions or comments.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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