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Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012

Jan 26, 2012

Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder.

Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder.

Christopher Associates Inc., one of the world’s leading technology solutions providers, announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012 at the San Diego Convention Center in San Diego, CA.  The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,” on Wednesday, February 29, 2012 from 10:15-11:45 a.m. The session will be chaired by Professor Carol Handwerker of Purdue University. 

With the tendency to look at alternative lead-free alloys to the standard lead-free Sn3Ag0.5Cu solder, more details are needed by the industry on the processability and reliability of these alternative lead-free solders.  Bath’s presentation will discuss low melting temperature tin-bismuth based lead-free solder alloy pastes with a melting temperature of 138°C in terms of printing, reflow and reliability investigations.  The session also will have presentations on nickel’s impact on lead-free solders as well as high melting lead-free solder alloys by speakers from solder suppliers.

For more information about Christopher Associates Inc. or Mr. Bath’s presentations, stop by Booth #2801 at the show or visit www.christopherweb.com

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