AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
NC259 Solder Paste has been developed in response to many issues that manufacturers face every day. It is the first low-cost, lead-free, halogen-free solder paste to offer the performance of tin-lead and high-silver lead-free solder pastes. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes. Additionally, the ability of NC259 to eliminate head-in-pillow failures is critical as the use of leadless devices like BGAs and QFNs increases.
AIM’s alcohol-based NC265LR and VOC-free NC275LR are halide-free, no-clean liquid fluxes formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC265LR and NC275LR offer low post-process residues and have proven to reduce preventative maintenance requirements for spray fluxing applications. These fluxes are compatible with a broad range of lead-free and tin-lead solder alloys.
Additionally, the company will highlight its tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium.
For more information, meet company representatives in Booth #2804 at the show or visit www.aimsolder.com.
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries.