SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces key events to further the industry’s knowledge base.
The first event is a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure that will take place on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK. Coffee will be served and the tabletop exhibition will begin at 9:30 a.m. The workshop will take place from 10 a.m.-4 p.m. Considerable research into the correct procedures to minimize problems with bare boards and components has culminated in IPC standards to help guide engineers to reduce the possibility of failure. This SMART Group event focuses on each of the issues associated with the prevention of failure, correct onsite operating procedures, and the equipment than can be used to store products and eliminate failures of this type. Attendees will receive a free set of wall charts on handling moisture-sensitive devices.
The cost to attend is £85 SMART Group members/£175 Nonmembers + VAT. For more information or to register for the event, contact the SMART Group at +44 (0) 1494 465217; email@example.com; www.smartgroup.org. To reserve tabletop space, contact Tony Gordon at the SMART Group or visit http://www.smartgroup.org/images/stories/events/TableTop2008.pdf.
The second event is a four-part Webinar series titled Guide to Modern Multilayer Manufacture Webinar. Part 1 will take place from 14.30-16.00 GMT on Tuesday, March 6, 2012. This series of webinars is designed for those new to the circuit industry, and is ideal for design and assembly engineers, purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step-by-step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble-free assembly. The schedule of Webinars and topics follows:
- March 6, 2012: PCB Manufacture Part 1 at 14.30 GMT; Topics addressed include laminate types, resist application, imaging/striping, etching & AOI, and oxide treatment.
- April 3, 2012: PCB Manufacture Part 2 at 14.30 BST; Topics addressed include lay up, lamination procedures, drilling including laser, die smearing and metallization.
- June 11, 2012: PCB Manufacture Part 3 at 14.30 BST; Topics addressed include resist application, imaging/etching, copper plating, solder mask and solder finishes.
- July 5, 2012: PCB Manufacture Part 4 at 14.30 BST; Topics addressed include legend, routing, electrical testing, inspection & QC, and PCB storage.
Four highly experienced PCB engineers will offer their advice during each Webinar. The price for the series, presentation materials and access to the online recordings is £200+VAT. A single Webinar can be booked at £65+VAT. To support the Webinar content, each delegate booking all four sessions will receive two sets of training charts covering PCB manufacture and typical PCB-related failures for company reference. Additionally, if a delegate cannot attend each of the four parts, the recordings will be available online.