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Excellent Drainage Properties of SN100C Confirmed in “Icicle” Test

Nov 08, 2011

Assessing the bridging and icicling tendencies of a solder

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, is proposing that its “Icicle Test” is one of the criteria electronics manufacturers should consider using as they struggle to find a basis for choosing between the various lead-free solders being offered for wave soldering.

The test involves the measurement of the length of the icicle left when a fluxed copper ring is immersed and then withdrawn from the molten solder. The length of the icicle left after this procedure has been completed is a measure of the ease with which excess solder can drain off a joint into the solder. Excess solder left on a joint as it exits the solder wave is the cause of bridging (shorts) as well as icicles, which slow production by necessitating expensive touch-ups.

When tested this way, Nihon Superior’s SN100C lead-free solder demonstrates a clear advantage. The icicle length of the Sn-Cu-Ni alloy is less than half that of other lead-free solders because of the beneficial effects of the Ni on fluidity and Ge on surface tension.

For further, more detailed information about the test, see:

*Please note that the results of the icicle test will depend on conditions. For more information, visit:

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

Feb 16, 2017 -

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Jan 10, 2017 -

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

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Nihon Superior to Hold 50th Anniversary Celebration in Japan

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Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Aug 26, 2015 -

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Jun 21, 2015 -

Nihon Superior Acknowledged for 2015 SMTAI Sponsorship

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