SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011

Oct 16, 2011

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability.

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), scheduled to take place November 15-16, 2011 at the McEnery Convention Center in San Jose, CA.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

Also featured at the show will be the Nordson DAGE μCT Inspection Option, which provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, sub-micron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation (Nasdaq: NDSN) is one of the world’s leading producers of precision dispensing equipment that applies adhesives, sealants, coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Apr 26, 2017 -

Nordson DAGE Picks Up Its Third Award for the Quadra™ 7 X-ray

Feb 15, 2017 -

Nordson DAGE Receives the 2017 NPI Award for Test & Inspection – X-ray

Nov 07, 2016 -

Nordson DAGE Announces Cabiotec as European X-ray Distributor of the Year for X-ray Systems 2016

Oct 06, 2016 -

Nordson DAGE Receives a Global Technology Award for Inspection – X-ray

Aug 30, 2016 -

Nordson DAGE to Show the Ultimate Flexible X-ray System – the Quadra™ 5

Aug 14, 2016 -

Nordson DAGE Announce European Distributor Network Changes

Jul 30, 2016 -

Nordson to Showcase Market-Leading Test and Inspection Systems at NEPCON South China

Jun 19, 2016 -

Nordson DAGE Will Show the New Quadra™ 7 X-ray Inspection System for the First Time at SEMICON West

Jun 13, 2016 -

Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools

102 more news from Nordson DAGE »

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

See electronics manufacturing industry news »

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011 news release has been viewed 606 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011
Plasma Prior to Conformal Coating

SMT Custom Nozzles