SMT, PCB Electronics Industry News

SMTA International Tackles Head-in-Pillow Defects

Aug 17, 2011

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject.  SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Dudi Amir, Intel Corporation, will discuss Head-in-Pillow defects in depth in his tutorial on Monday, October 17.  Dudi will instruct how to identify the root cause of the failure and give potential solutions to prevent the defect from happening and create a robust SMT assembly process. Also discussed will be various failure analysis techniques to identify head-and–pillow non wet and several case studies.

Jasbir Bath, Owner, Bath Technical Consultancy, will chair a technical session focused on Solder Paste Development, Component Warpage Measurement and Case Studies and featuring presentations from Cookson Electronics, ZN Technologies, and Intel Corporation.  Jasbir recently commented that, "Head-in-Pillow component soldering defects are still a concern in the industry with the session looking at developments in solder paste and component warpage measurement equipment as well as reviewing warpage information for components. There is still work to be done in updating component and board warpage standards and this session along with other information from the conference will give an update on where the industry is in reducing this defect and where it needs to go."

The presentation about board warpage by John Davignon, Intel Corporation and the INEMI SMT Co-Planarity Work Group, may also be of interest to attendees looking for background about HiP.  The paper is titled "Industry Snapshot of PCB Dynamic Co-Planarity at Elevated Temperatures."

Details about SMTA International can be found online at or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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