Jun 07, 2011 
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit a complete range of advanced soldering materials ranging from tin/lead to lead-free SN100C-XF3+ solder paste and wire, and new high-performance fluxes at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Sheraton Bloomington Hotel in Bloomington, MN.
Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.
SN100C-XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.
