Axel Vargas, Application Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present “Fluid Flow Mechanics – Key to Low Standoff Cleaning” at the SMTA’s Tampa Chapter Vendor Show held at the Minnreg Building, 6340 126th Ave., Largo, FL 33773 on June 14, 2011. Show hours are from 4:30 pm to 8:30 pm.
More than five years ago, ZESTRON first discussed cleaning underneath 4 MIL standoff components. With the emergence of lead-free solder and flux as well as a miniaturization of components and an increase in board densities, the latest challenges include components with less than 1 MIL gaps.
This study was designed to specifically investigate the impact of mechanical vs. chemical energy during the removal of contamination under 1-2 MIL standoff components. To validate the results obtained, extensive experiments were conducted, including actual user case-studies, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help customers in the future. These included but were not limited to various flow patterns and industry leading cleaning agents. As a result, the authors also included experimental data that addressed fluid flow mechanics as well as temperature and concentration related effects.
For more information on this topic, please join Mr. Axel Vargas at the SMTA’s Tampa Chapter show or contact ZESTRON’s Application Technology Department at (703) 393-9880
(www.zestron.com). To register for this event, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=15.
Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements.