SMT, PCB Electronics Industry News

IMAPS New England 2016

Apr 08, 2016

IMAPS New England is 1 month away!
VISIT YINCAE Booth
Join Dr. Yin’s Presentation May 3rd, 1PM

(Albany, NY) 4/8/2016 –  IMAPS New England 43rd Symposium & Expo is 1 month away! The tradeshow will take place at The Holiday Inn Conference Center, in Boxborough, MA, May 3rd 2016. YINCAE hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer.

Dr. Yin will be presenting his white paper, “Room Temperature Fast Flow Reworkable Underfill for LGA”. The presentation will be May 3rd at 1PM. This paper will focus on the miniaturization of electronic devices and how Land Grid Array(LGA) or QFN has been widely used in these electronic devices. The paper will discuss how a room temperature fast flow reworkable underfill will help improve the quality control and reliability issue of said devices.  

YINCAE Advanced Materials, LLC hopes that you will join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at our booth!

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by going to yincae.com.

 * * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 22, 2023 -

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Mar 27, 2023 -

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Nov 08, 2022 -

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Aug 16, 2022 -

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Mar 30, 2022 -

YINCAE's DA158N Die Attach Materials withstanding -273°C

Dec 22, 2021 -

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Feb 24, 2021 -

YINCAE's New SMT 158N Series withstanding -273°C

Jan 21, 2021 -

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Aug 04, 2020 -

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Sep 05, 2019 -

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

48 more news from YINCAE Advanced Materials, LLC. »

Apr 26, 2024 -

KDPOF Collaborates with Hinge Technology

Apr 25, 2024 -

Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany

Apr 23, 2024 -

New Energy Automotive: I.C.T.'s Conformal Coating Line Expertise in Mexico

Apr 22, 2024 -

ZESTRON Welcomes Whitlock Associates as new Addition to their Existing Rep Team in Florida

Apr 22, 2024 -

IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford

Apr 22, 2024 -

Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Apr 22, 2024 -

Camera Microscopes: A Game Changer for Electronics Manufacturing

Apr 22, 2024 -

SMTXTRA Appoints MaRC Technologies as Representative for the Pacific Northwest

Apr 22, 2024 -

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

Apr 22, 2024 -

Apollo Seiko's J CAT LYRA + ARC 5000 Goes Beyond Traditional Soldering at SMTA Wisconsin

See electronics manufacturing industry news »

IMAPS New England 2016 news release has been viewed 973 times

Jade Series Selective Soldering Machines

Conductive Adhesive & Non-Conductive Adhesive Dispensing