SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Dec 05, 2015

Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.

TSV Passivation/Sealing with EMS DF-1020 film

The DF-1000 series is available in various thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-1000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (by DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. Additionally, the film is hydrophobic in nature, providing for both chemical and moisture resistance.

DF-1000 series films are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and TSV passivation/sealing applications.

Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists, conductive and non-conductive adhesives for semiconductor and circuit assembly applications.

For more information about the DF-1000 series films or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit EMS/Nagase at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition or visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

52 more news from Engineered Materials Systems, Inc. »

Jan 18, 2018 -

KYZEN Partners with Aurotech to Service Philippines Customers Faster and Better

Jan 18, 2018 -

MIRTEC Europe Celebrates 10 Years of Consistent Inspection Innovation

Jan 18, 2018 -

Inovar, Inc. Celebrates 20 years as a Leading Electronic Manufacturing Company Milestone recommits the company to its purpose and core values

Jan 18, 2018 -

Saelig Introduces RSA5000 3.2/6.5GHz Real-Time Spectrum Analyzers

Jan 18, 2018 -

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Jan 17, 2018 -

Inovaxe to Showcase Its Intelligent Ultra-Lean Total Material Handling and Storage Solution at SMTA Space Coast Expo

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

CalcuQuote Exhibits at IPC APEX Expo 2018

See electronics manufacturing industry news »

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference news release has been viewed 894 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Plasma Prior to Conformal Coating

High Precision SMT Fluid Dispensers