SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Dec 05, 2015

Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.

TSV Passivation/Sealing with EMS DF-1020 film

The DF-1000 series is available in various thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-1000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (by DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. Additionally, the film is hydrophobic in nature, providing for both chemical and moisture resistance.

DF-1000 series films are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and TSV passivation/sealing applications.

Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists, conductive and non-conductive adhesives for semiconductor and circuit assembly applications.

For more information about the DF-1000 series films or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit EMS/Nagase at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition or visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Mar 12, 2018 -

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 08, 2018 -

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 -

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

56 more news from Engineered Materials Systems, Inc. »

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

Apr 18, 2018 -

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

Seika Announces Plans for Optimized Drying Units to be Incorporated into all McDry Cabinets

Apr 17, 2018 -

Libra Industries Sponsors SMTA Ohio Valley Membership Appreciation Golf Outing

Apr 17, 2018 -

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Apr 17, 2018 -

cost saving SMT laser cut stencil

See electronics manufacturing industry news »

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference news release has been viewed 1009 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Plasma Prior to Conformal Coating