SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Koh Young Technology Highlighting Expanded Inspection Capabilities at APEX 2019

Koh Young Technology Highlighting Expanded Inspection Capabilities at APEX 2019

Jan 15, 2019

See the latest smart inspection solutions from Koh Young in booth 1908 at IPC APEX Expo in San Diego

See the latest smart inspection solutions from Koh Young in booth 1908 at IPC APEX Expo in San Diego

Seoul, South Korea – As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX Expo during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at Booth 1908 in the San Diego Convention Center.

Leveraging its core strengths in robotics and true 3D measurement, Koh Young will bring the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for Final Optical Inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability.

Koh Young will also highlight its latest Machining Optical Inspection (MOI) system. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, volume, and more. Committed to bringing about “Smart Manufacturing” innovations, the MOI system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls.

Beyond pin and machined part inspection capabilities, Koh Young will present the latest Meister D solution focused on the SiP (System-in-Package) assembly process. The new machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With component inspection down to 008004 inch (0201M), the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection.

As the absolute leader in 3D inspection market, Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at Booth 1908, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.  

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 25, 2024 -

Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany

Mar 19, 2024 -

Koh Young America Appoints Heriberto Cuevas as Sales Team Leader for Mexico and South America

Mar 11, 2024 -

Koh Young Invites Electronics Manufacturers to See Its Data-driven Approach to Inspection at IPC APEX Expo

Feb 26, 2024 -

Koh Young Highlighting its Award-winning Inspection Solutions at IPC APEX EXPO on April 09-11, 2024, in Anaheim, CA

Feb 19, 2024 -

A Confluence of Expertise: Lean Stream, Fuji America Corporation, and Koh Young America Unite to Unveil a New Collaborative Workspace

Feb 07, 2024 -

SMTA Carolinas Chapter In-Person Technical Meeting to Improve SMT Quality with Accuracy and Force Validation

Feb 06, 2024 -

Koh Young Strengthens Mexico Sales Team with Addition of Hector Hernandez

Jan 29, 2024 -

Koh Young Shares Revolutionary Advanced Package Inspection Solutions at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 12 February 2024

Jan 23, 2024 -

Koh Young Shares Inspection Solutions at the SMTA Wafer-Level Packaging Symposium12 February 2024

183 more news from Koh Young America, Inc. »

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 29, 2024 -

New! Model ZM-R750 PC Controlled BGA Rework Station.

Apr 29, 2024 -

RAY TECH (MALAYSIA), UNICOMP Technology's first overseas production base officially in operation to follow Belt and Road Initiative

Apr 29, 2024 -

Aven Launches the Cyclops 4K Ultra HD Digital Microscope: Redefining Precision Viewing

Apr 29, 2024 -

SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event

Apr 29, 2024 -

KYZEN Announces Exclusive Partnership with Manufacturers' Representative Restronics Florida

Apr 29, 2024 -

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

Apr 29, 2024 -

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum

Apr 29, 2024 -

SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories

Apr 29, 2024 -

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

See electronics manufacturing industry news »

Koh Young Technology Highlighting Expanded Inspection Capabilities at APEX 2019 news release has been viewed 868 times

  • SMTnet
  • »
  • Industry News
  • »
  • Koh Young Technology Highlighting Expanded Inspection Capabilities at APEX 2019
IPC Training & Certification - Blackfox

ICT Total SMT line Provider