Datest is pleased to announce that it received a 2022 Mexico Technology Award in the category of Test Services for its Enhanced High Density Precision Geometry Flying Probe Wafer Testing Services. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
“What started—as innovations often do—as an R&D project for one demanding customer, has grown into a service for the wider OEM and EMS test market,” said Robert Boguski, President. “The equipment manufacturers said it couldn’t be done, then turned the other way when we did it. Now they are our biggest cheerleaders, and salivate over the next batch of impedance test data. So is progress made: once a pipedream, now proven and production-ready. That’s how innovation works, and this is how we do it: thousands of times a day.”
Datest offers programming, testing, and evaluation/troubleshooting services for high-density wafers using flying probe test technology. High-density wafers are the packaging backbone of large, complex algorithmic computing systems, often forming the computer-on-a-chip core of systems used in massive data-crunching fields such as drug development; genomic sequencing; epidemiological modeling; cryptography and system security; aerodynamic research; fluid flow dynamic simulation and prediction; and other sophisticated applications demanding very high clock speeds and processing power.
Datest’s production-level flying probe wafer testing services are the product of a three-year effort to push the boundaries of machine limits above and beyond normal warranty-voiding thresholds. It is one thing to land one probe on a 250µm etched pad. Try doing the same with two, as part of a four-wire (Kelvin) impedance test, and doing it repeatedly, with precision, on thousands of test points on a typical wafer layer, or wafer-based subsystem. Then do the same process 29 additional times (times thousands of probe contacts per wafer) to complete impedance testing of a typical production batch of high-density wafers, and do it with confidence of in the solidity and repeatability of probe placement, and the ensuing results.
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers during the last 12 months. For more information, visit www.mexicoems.com/mta-awards.
With more than 38 years of expertise, Datest offers in-circuit testing (ICT), flying probe testing, X-ray inspection, boundary scan/JTAG testing, functional testing, failure analysis and other related analytical and laboratory services. Datest is an ISO9001:2015, ITAR and AS9100D-certified company, and a member of IPC, IEEE, EIPC and ASNT. Datest is a proud and active member of SMTA.
For more information about Datest or to view the company’s complete service lineup, visit www.datest.com, or call (510) 490-4600.
Datest was founded in 1984 to address the growing trend of outsourcing assembly test services, together with increasing OEM demands that EMS providers deliver fully tested, functioning product. The company integrates traditional electrical board test methodologies (ICT, Flying Probe, and JTAG/Boundary Scan) with failure analysis (nondestructive as well as destructive), reverse engineering and “bonepile” rehabilitation, functional test development, and analytical laboratory services. Datest also offers comprehensive X-ray services (2D, 3D, and CT) for root cause analysis, high-level inspection and metrology, and dispute resolution. Datest is frequently the final say in third-party dispute resolution. The Datest suite of services includes a 225kV microfocus CT system from VJ Technologies, offering CT scanning and failure analysis services for all manner of larger objects besides printed circuit board assemblies. Datest is ITAR registered and has a quality management system (QMS) that is certified to ISO9001:2015 and AS9100D. Datest is a member of SMTA, IPC, IEEE, EIPC and ASNT (American Society for Nondestructive Testing).
For more information, visit www.datest.com.