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Endicott Interconnect�s Markovich Receives the Northeast Regional Industrial Innovation Award

Oct 17, 2006

Voya R. Markovich was selected by the American Chemical Society (ACS) to receive this year�s Northeast Regional Industrial Innovation Award. The awards ceremony, held in conjunction with the 34th Northeast Regional Meeting of the ACS, took place on Friday, October 6th at the Holiday Inn Arena in Binghamton, New York.

This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems.

Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.

�Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors,� commented James J. McNamara, President and CEO at EI. �We are proud of Voya�s accomplishments and thank him for his many innovations that have contributed to EI�s success,� he continued.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a worldclass supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-tomarket advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

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