SMT, PCB Electronics Industry News

BEST SMT Boot Camp Nov 29-Dec 1, 2016 Featuring Phil Zarrow

Oct 25, 2016

Introduction

  • Introduction and overview of the SMT assembly process.
  • RoHS

PCB Board Fab

  • How boards fabbed
  • Surface finishes
  • Laminates
  • Flex

Solder paste

  • Basics of  the soldering process including alloys, fluxes, solder paste, rheology and intermetallic bond.  
  • Analysis of the stencil printing process including using Gerber data to manufacture stencils, different stencil considerations, squeegee selection and considerations, etc.  Paste deposition will be discussed along with common defects found during the stenciling process and the best resolution. 

Stencil design

  • Chem-etch, laser cut, e-form
  • Aperture designs
  • IPC-7525 stencil design guidelines

Printing parameters

  • Squeegee speed and pressure plus other important parameters
  • Under stencil wiping-wet and dry
  • Solder paste inspection
  • Defects typically associated with the printing process

Component Placement

  • Analysis of component placement process, machine types, where typical defects can occur and the best resolution. 
  • Machine architecture
    • Turret machines
    • Modular-all manufacturers now
    • Hybrid machines

Overview of the placement process in SMT-tour

  • Board Profiling
  • Reflow

Analysis of the reflow process and profiling. 

  • How to build a robust SMT profile, typical defects and the best resolution. 
  • Straight ramp vs ramp/soak/spike
  • Impact of cooling cycle
  • Effects of N2
  • Defects causes by improper profile

Wave Soldering

  • Analysis of the wave solder and selective solder process including profile generation, flux application and defect recognition/root cause analysis.  Hands on at the wave solder machine.
  • Flux application-spray, foam, drop jet
  • Effects of N2
  • Defects at the wave

Cleaning and cleanliness testing

  • Why Clean
  • Cleaning Chemistries
  • Manual Cleaning
  • Cleaning Equipment – Automated Cleaning
    • Vapor Degreaser
    • Aqueous/Semi Aqueous-Batch and In-Line
  • Cleanliness testing

Testing

  • Overview of the test process including AOI, AXI, ICT, flying probe and functional.

Day 3-

  • Component ID
  • PCB board fab process and tour
  • Stencil fab process
  • Stencil fab tour
  • Printing demonstration
  • Solder paste printing and placement demo
  • X-ray equipment demo
  • Tour of testing facility ICT and flying probe

Testing and certification

Mar 20, 2018 -

BEST Announces Availability of Custom Electronics Packaging

Nov 25, 2017 -

FREE IPC-A-610 and J-STD-001

Oct 03, 2017 -

New Sustainable J-STD-001 Soldering Kit

Oct 03, 2017 -

New Sustainable J-STD-001 Soldering Kit

Mar 31, 2017 -

BEST Inc. Puts Semi-Automated Mass PCB Rework Process Online

Sep 01, 2016 -

New Hands On Class for Wire/Cable Assembly

May 25, 2016 -

BEST Releases 2nd Half Training Schedule for 2016

Apr 20, 2016 -

Award for New Product Innovation Announced

Feb 27, 2016 -

BEST, Inc. Will Be Conducting 2 Training Sessions at the IPC APEX Expo 2016

Jan 05, 2016 -

BEST Developes Revolutionary Gel for Masking of Parts

20 more news from BEST Inc. »

Apr 22, 2018 -

Tom Forsythe Will Present Industry 4.0 Cleaning Methods at the eSMART Factory Conference

Apr 22, 2018 -

STI Announces Ann Duncan’s Retirement

Apr 22, 2018 -

The Murray Percival Company Now Represents optical control’s Component Counting Technology

Apr 22, 2018 -

Sheri Pear Joins MicroCare, Will Focus on Customer Communication

Apr 22, 2018 -

Aegis Software Presents “MES Digitally Remastered” At SMT Nuremberg

Apr 22, 2018 -

Vi TECHNOLOGY to showcase the most innovative SPI product since the introduction of Moiré systems

Apr 22, 2018 -

Don’t Miss Ersa at the SMTA Empire Expo!

Apr 22, 2018 -

PDR Appoints Technical Marketing Company in the Rocky Mountain Region

Apr 22, 2018 -

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

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