Mar 18, 2024 Solderstar is set to showcase its latest innovation at the EPP InnovationsFORUM 2024 in Leinfelden-Echterdingen, Germany on 17th April. Taking centre stage will be the Reflow Shuttle O2 an advanced process verification tool designed to enhance quality control in electronics manufacturing.
The Reflow Shuttle O2 marks a major advancement by integrating real-time oxygen level monitoring in parts per million (ppm) alongside other critical process parameters like vibration, vacuum, temperature profiles, and conveyor speed into one comprehensive platform. This innovative combination provides manufacturers with an unparalleled level of insight and control over their soldering operations.
Chris Williams, Head of European Sales at Solderstar said: "April is an exciting month for Solderstar as we exhibit at two major events - IPC APEX Expo in the U.S. and the EPP InnovationsFORUM in Europe. At both shows, we're pleased to showcase our innovative thermal profiling systems including the new Reflow Shuttle O2.
"The Reflow Shuttle O2 fulfils a critical requirement in advanced manufacturing by providing precise real-time monitoring and control of oxygen levels throughout the reflow process. With its zone isolation technology, it detects fluctuations in oxygen levels, allowing users to optimise nitrogen usage, quickly identify leaks across the entire oven, and consistently achieve superior solder joint integrity. This level of precision is particularly important for high-precision applications. By facilitating detailed monitoring, it enables the detection of problematic oven zones and quantification of nitrogen consumption, thereby facilitating data-driven process refinement."
Complementing its oxygen monitoring capability, the Reflow Shuttle O2 offers a range of advanced measurement modules. Vibration sensing across three axes guides acceptable operating parameters, while dedicated vacuum sensors verify pressure levels down to 10 mbar, calculating critical metrics such as hold times to mitigate component shifts.
High-precision sensors meticulously map the performance of both top and bottom heaters, providing valuable insights into heating uniformity. Positioned at the front of the Shuttle are temperature sensors precisely calibrated for accuracy, offering crucial data on the consistency of heating across the entire width of the heated zone.
Solderstar's latest profiler streamlines verification processes by consolidating various measurement disciplines onto a single, robust shuttle, engineered for seamless integration into any reflow oven. Machine operators benefit from an intuitive interface that simplifies data collection and enables real-time adjustments based on identified process variations.
The EPP InnovationsFORUM 2024 presents the ideal platform to present the benefits of the Reflow Shuttle O2 to electronics manufacturers in Europe. Solderstar's team of experts will be on hand to provide detailed insights, live demonstrations, and answers any technical enquiries.
www.solderstar.com
Solderstar is a recognised technology leader in the design and manufacture of thermal profiling systems for electronic soldering processes.
With offices in UK, USA and a technical centre in Germany the company offers the most comprehensive range of process control support and solutions for electronic manufacturers.
Solderstar personnel have over 30 years of temperature profiling design experience, combined with in-depth industry and process knowledge, and a ‘can do’ attitude to product and process improvement.
When Solderstar launched its first product offerings, lead-free manufacturing was, for most in the industry, a dot on the horizon. For Solderstar, lead-free soldering was already upon us. It was recognised early-on that soldering within electronic assemblies was set to go through something of a revolution, with new thermal processes needing to be established and controlled like never before. It was seen that electronics manufacturers all over the world would need improved thermal profiling solutions capable of meeting the demands of the newly emerging thermal processes and advancement in soldering machines and ovens.
To respond to this, Solderstar developed class leading instrumentation and software that streamline the whole profiling process across reflow, wave, selective and vapour phase soldering processes. Solderstar has grown from strength to strength, completely dedicated from the outset to the needs of the electronic manufacturer. Solderstar is committed to excellence in design, customer support and product innovation.
Today, Solderstar products undoubtedly have ‘raised the bar’ and will continue to set the standard through our commitment to continual improvement of our products, and our ability to combine powerful functionality with robustness, accuracy, and simplicity.
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