SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Aug 15, 2013

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing.  The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Heller Industries and IBM Microelectronics will jointly develop the optimum materials, equipment, process parameters, monitoring systems and thermal profiles required to implement the fluxless mass reflow tooling and process in a high volume manufacturing environment.

Advanced semiconductor device packaging presents the industry with significant challenges due to reduced bump size and increased I/O density.” said David Heller, CEO of Heller Industries.  “The gaseous fluxing process may become instrumental in helping our customers develop their next generation chip packaging technologies.  In entering this agreement Heller and IBM will take advantage of Heller’s thermal management and equipment development expertise and IBM’s wide range of experience, technology and process knowledge for advanced component packaging.”

The joint Heller & IBM team will implement the program at the Heller Industries corporate headquarters in Florham Park NJ, IBM’s manufacturing facility in Bromont, Canada and at IBM’s state-of-the-art Semiconductor Research and Development Center in East Fishkill, N.Y.


Heller Industries is a global industry leading supplier of thermal process solutions for the Semiconductor, SMT and Solar markets. Heller has pioneered many significant technology innovations in the reflow and curing processes. www.hellerindustries.com

Jun 22, 2016 -

Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0

Nov 12, 2015 -

Lean Stream & Heller Reflow Technology to Partner in CA & NV

May 18, 2015 -

Heller Industries Mark 5 Wins 2015 SMT China Vision Award

Sep 06, 2014 -

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Apr 11, 2014 -

Heller Industries, a 2014 Service Excellence Award Winner for Soldering Equipment

Sep 10, 2013 -

Heller opens Cleanroom in New Jersey Factory.

May 21, 2013 -

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Jan 04, 2013 -

Heller Industries to Exhibit at APEX 2013 -Booth 1109

Jan 04, 2013 -

Heller Shanghai Celebrates 10 Year Anniversary on Jan 31, 2013

May 11, 2012 -

Heller Industries Mark 5 Wins 2012 VISION Award

3 more news from Heller Industries Inc. »

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

See electronics manufacturing industry news »

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing news release has been viewed 1321 times

  • SMTnet
  • »
  • Industry News
  • »
  • Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing
Reflow Oven

reflow oven profiler