SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Aug 15, 2013

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing.  The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Heller Industries and IBM Microelectronics will jointly develop the optimum materials, equipment, process parameters, monitoring systems and thermal profiles required to implement the fluxless mass reflow tooling and process in a high volume manufacturing environment.

Advanced semiconductor device packaging presents the industry with significant challenges due to reduced bump size and increased I/O density.” said David Heller, CEO of Heller Industries.  “The gaseous fluxing process may become instrumental in helping our customers develop their next generation chip packaging technologies.  In entering this agreement Heller and IBM will take advantage of Heller’s thermal management and equipment development expertise and IBM’s wide range of experience, technology and process knowledge for advanced component packaging.”

The joint Heller & IBM team will implement the program at the Heller Industries corporate headquarters in Florham Park NJ, IBM’s manufacturing facility in Bromont, Canada and at IBM’s state-of-the-art Semiconductor Research and Development Center in East Fishkill, N.Y.


Heller Industries is a global industry leading supplier of thermal process solutions for the Semiconductor, SMT and Solar markets. Heller has pioneered many significant technology innovations in the reflow and curing processes. www.hellerindustries.com

Jul 02, 2018 -

No 25% Import Duty on Heller Reflow Ovens

Sep 16, 2017 -

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Jun 22, 2016 -

Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0

Nov 12, 2015 -

Lean Stream & Heller Reflow Technology to Partner in CA & NV

May 18, 2015 -

Heller Industries Mark 5 Wins 2015 SMT China Vision Award

Sep 06, 2014 -

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Apr 11, 2014 -

Heller Industries, a 2014 Service Excellence Award Winner for Soldering Equipment

Sep 10, 2013 -

Heller opens Cleanroom in New Jersey Factory.

May 21, 2013 -

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Jan 04, 2013 -

Heller Industries to Exhibit at APEX 2013 -Booth 1109

5 more news from Heller Industries Inc. »

Jul 15, 2018 -

Great Results from Europe’s First atom Platform Installation at Syselec France.

Jul 12, 2018 -

Epec Partners with Wounded Warrior Project

Jul 12, 2018 -

Lacon Electronic GmbH acquires TRI's AOI Solution for Zero Tolerance

Jul 11, 2018 -

Kurtz Ersa Inc. Expands Its North American High-Tech Demo Center

Jul 11, 2018 -

ADLINK Joins Open Networking Foundation (ONF) as Collaborating Innovator to Boost Transformation of Network Infrastructure

Jul 11, 2018 -

IPC Releases 2018 Quality Benchmark Study for Electronics Assembly

Jul 10, 2018 -

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Jul 10, 2018 -

KYZEN today announced the opening of a new state-of-the-art Applications Lab by Astronics Technologies (Thailand) Co. Ltd.

Jul 10, 2018 -

optical control GmbH & Co. KG, a leader in automated component counting technology using X-ray imaging, has hired Mr. Rudy Tan to build and manage its team and continued growth in Asia.

Jul 10, 2018 -

Circuitronics Adds New SMT Line Dedicated to Quick Turn and Prototyping

See electronics manufacturing industry news »

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing news release has been viewed 50 times

  • SMTnet
  • »
  • Industry News
  • »
  • Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing
reflow oven profiler

Metcal soldering rework