"With the formation of this Technology Network, we will be able to offer our customers improved quality, faster product introduction and process stabilization. Our experience in cutting-edge electronics manufacturing ensures our customers an integrated process development and implementation that takes into account the interaction of design, materials, equipment and processes."
The SIPLACE Advanced Assembly Technology Network will provide services covering all areas of assembly and packaging technologies including process development, reliability testing, semiconductor device and package qualification, process support and process consulting, materials qualification, new product introduction, prototyping, failure analysis and analytical services. In addition, technology training from industry experts will be offered through the Advanced Assembly Technology Network around the world.
To find out additional information about the newly formed Advanced Assembly Technology Network, Contact your local SIPLACE sales representative or visit our website at http://www.siplace.com.