SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

Oct 04, 2020

IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications.  Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.

The IPC D-33AM Task Group developing IPC-6012EM realized that there are two different focuses for electronics in the medical device industry sector: the relatively high-volumeproduction of “standard-sized” printed boards for medical diagnostic equipment applications; andthe miniature, high density printed boards for very small devices which are often human body implantable.

“We understand the medical industry utilizes electronics in laser surgical devices, radiation emitting devices, x-ray machines, ultrasound devices and implantables where product failure can result in the high risk of injury to the patient,” noted John Perry, IPC director of printed board standards and technology. “IPC recognized the industry’s desire for more stringent printed board fabrication requirements than can be provided within the current IPC Class 3 Performance class for these types of medical devices. The IPC D-33AM Task Group was created to develop an addendum to the base IPC-6012E printed board performance specification that addresses those technological needs.” 

IPC’s family of printed board design standards (IPC-2220 series) and board performance specifications IPC-6010 series) make use of three IPC producibility levels, intended to convey to the end user an increasing cost and sophistication with respect to fabricating printed board features of smaller and smaller size. IPC-6012EM is the first addendum to an IPC specification that makes use of a new design level “D”, which was created to address the miniaturization level of medical devices. This new design level “D” goes beyond the typical feature sizes of what is typically considered “high density interconnect” (HDI) and addresses conductor width/spaces below 60 µm as well as via structures below 100 µm.

Many regulatory requirements provided by both the United States Food and Drug Administration (FDA) and the European Union (EU),help ensure the safety and security of human beings (and animals) with respect to not only human and veterinary drugs and biological products, but also electronic medical devices. Examples include the EU Medical Device Directive, EU Active Implantable Medical Devices Directive and the EU Commission Regulations. As noted by Andres Ojalill, IPC technical staff liaison to the IPC D-33AM Task Group, “IPC-6012EM has been written to streamline the production of high reliability printed boards for medical devices in accordance with regulations mentioned above so that there are no gaps between technical and regulatory requirements.”

For more information on IPC-6012EM, visit https://shop.ipc.org/IPC-6012EM-English-D.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 6,000 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices Washington, D.C.; Atlanta, Ga.; Miami, Fla.; Brussels, Belgium; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Apr 29, 2024 -

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

Apr 29, 2024 -

IPC Design Competition Champion Crowned at IPC APEX EXPO 2024

Apr 29, 2024 -

Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610

Apr 29, 2024 -

Janene Stinson, Boeing, Earns IPC Excellence in Education Award at IPC APEX EXPO 2024

Apr 29, 2024 -

What's Next Becomes Now at IPC APEX EXPO 2024

Apr 22, 2024 -

IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford

Apr 22, 2024 -

Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Apr 22, 2024 -

IMAPS & IPC to Host Onshoring Workshop April 29 – May 1, 2024, in Arlington, Virginia

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

1481 more news from Association Connecting Electronics Industries (IPC) »

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 29, 2024 -

New! Model ZM-R750 PC Controlled BGA Rework Station.

Apr 29, 2024 -

RAY TECH (MALAYSIA), UNICOMP Technology's first overseas production base officially in operation to follow Belt and Road Initiative

Apr 29, 2024 -

Aven Launches the Cyclops 4K Ultra HD Digital Microscope: Redefining Precision Viewing

Apr 29, 2024 -

SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event

Apr 29, 2024 -

KYZEN Announces Exclusive Partnership with Manufacturers' Representative Restronics Florida

Apr 29, 2024 -

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

Apr 29, 2024 -

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum

Apr 29, 2024 -

SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories

Apr 29, 2024 -

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

See electronics manufacturing industry news »

IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards news release has been viewed 745 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Sell Your Used SMT & Test Equipment

Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB