Aug 06, 2001 Steve Dowds, Manager, Emerging Technologies for ICA, stated, �Flexible circuitry manufacturers switching to lead-free soldering processes have serious concerns. Flexible circuitry is typically more vulnerable to thermal damage than rigid Printed Circuit Board Assemblies, and most of the new lead-free alloys require even higher temperatures to melt than tin-lead solders do. NC-SMQ�81is the way for flexible circuitry manufacturers to go to lead-free processing without damaging their products.�
In a typical reflow soldering profile (forced convection system), its minimum peak temperature is 170 degrees C. (in order to pass SIR) with a max. temperature of 195 degrees C. Individual profiles will vary slightly with different product assemblies. NC-SMQ�81 meets J-STD-004 and -005 criteria, as well as Bellcore, ANSI/IPC-SF-818/SP-819 and Mil-P-28809 specifications, and accordingly guarantees high reliability performance.
NC-SMQ�81 Solder pastes are made from low-oxide, spherical powder composed of Sn-Bi-Ag and other low temperature alloys. A standard mesh size of �325/+500 (25-45m) is readily available and nonstandard mesh sizes including �400/+635 (20-38m) can be supplied upon request.
The Indium Corporation of America is a leader in technologically advanced electronic assembly materials and global provider of solders, fluxes, inorganic indium compounds and pure indium. For more information, visit http://www.indium.com, or contact the company at 34 Robinson Road, Clinton, NY 13323 USA, Tel.: 315.853.4900, Fax: 315.853.1000.
