SMT, PCB Electronics Industry News

BTU Releases the Next-Generation Reflow Oven Platform – Aurora

Apr 24, 2023

BTU International, Inc. today announced the release of its newest reflow oven platform. Aurora is leading the way to the factory of the future by seeing reflow in a new light.  

Aurora, the newest reflow oven platform, is designed based on years of expertise and leadership from BTU, the makers of the industry’s best performing reflow ovens. As the latest in a long line of world-class thermal systems, Aurora has quality and innovation in its DNA.

“It has always been the goal of BTU International to enable our customer’s success – and we’ve packed this new reflow oven platform with features that maximize thermal performance and productivity while decreasing maintenance and running costs,” said Rob DiMatteo, general manager of BTU International.  “The Aurora was designed based on our many decades of experience in reflow with an eye to the future.”

Aurora systems feature a modern, fully updated user interface, integrated Aqua Scrub™ flux management technology, innovative Smart Power energy savings software, and advanced process control technologies.  Aurora’s combination of superior thermal performance, process flexibility, and vision for the future sets the new standard for reflow ovens today – and for tomorrow.

This new reflow oven platform features the industry’s first factory configurable heating and cooling architecture providing the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling requirements, or increased throughput. In addition, the Aurora reflow platform features BTU’s exclusive closed-loop convection control technology that has been shown to maintain thermal performance even at significantly increased belt speeds, providing greater productivity, efficiency and throughput.

To learn more visit www.btu.com.


BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market.  BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

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